# US 12,109,734 B2 · Manufacturing of imprint mold-forming substrate

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- Number: US 12,109,734 B2
- Document ID: US12109734B2
- Status: Granted
- Kind: B2
- Application number: 17/030,813
- Filed: 2020-09-24
- Published: 2022-03-24
- Granted: 2024-10-08
- Earliest claimed: 2020-09-24
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Hiroyuki Yamazaki; Daiyu Okafuji; Masaki Takeuchi
- Web page: https://patentgrep.com/patent/US12109734B2

## CPC

- B29C 33/3842: {Manufacturing moulds, e.g. shaping the mould surface by machining}
- G03F 7/0002: {Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping}
- H10P 76/20: of masks comprising organic materials
- B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00)
- G03F: PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR; (phototypographic composing devices B41B; photosensitive materials or processes for photographic purposes G03C; electrophotography, sensitive layers or processes therefor G03G)
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

An imprint mold-forming substrate is manufactured by providing a starting imprint mold-forming substrate (1) having a patterned portion (2) and a non-patterned portion (5), providing a table (3) having a recess (4), bonding the substrate (1) to the table (3) such that the patterned portion (2) is received in the recess (4) of the table to define a space region (7) between the patterned portion (2) and the table (3) such that the patterned portion is not in direct contact with the table, and performing contour machining on the substrate (1) secured to the table (3).

## Claims

### Claim 1

A method for manufacturing a nanoimprint mold-forming substrate, comprising the steps of:
providing a starting imprint mold-forming substrate having a patterned portion and a non-pattemed portion, the starting imprint mold-forming substrate comprising: a front surface, a back surface, a side surface, and optionally a chamfer, wherein the patterned portion is provided on the front surface, wherein the non-patterned portion is provided on the front surface, the back surface, the side surface and optionally the chamfer,
providing a table having an upper surface comprising a contact surface having a first area and a recess having a second area, the recess recessed from the contact surface, the first area of the contact surface being larger than the second area of the recess,
bonding the starting imprint mold-forming substrate at its non-patterned portion of the front surface to the table such that the patterned portion of the starting imprint mold-forming substrate is received in the recess of the table to define a space region between the patterned portion and the table such that the patterned portion is not in direct contact with the table, wherein the distance between the patterned portion and the table in the space region is at least 100 μm in a horizontal direction parallel to the upper surface of the table and at least 10 μm in a vertical direction perpendicular to the upper surface of the table,
performing contour machining to grind at least a portion of the non-patterned portion when the starting imprint mold-forming substrate is secured to the table, and
obtaining the nanoimprint mold-forming substrate wherein the back surface comprises a first surface extending horizontally, and optionally a second surface extending perpendicularly.

### Claim 2 (depends on 1)

The method of claim 1, wherein the back surface comprises the first surface and the second surface, such that the nanoimprint mold-forming substrate comprises a non-through bore on the back surface.

### Claim 3 (depends on 1)

The method of claim 1, wherein the starting imprint mold-forming substrate comprises the chamfer, wherein the non-patterned portion is provided on the front surface, the back surface, the side surface and the chamfer.

### Claim 4 (depends on 1)

The method of claim 1, wherein in a cross-sectional view of the starting imprint mold-forming substrate and the table, a total length of the starting imprint mold-forming substrate in contact with the table is larger than a length of the starting imprint mold-forming substrate which does not contact the table and is inside the recess.

### Claim 5 (depends on 1)

The method of claim 1, wherein the back surface consists of the first surface extending horizontally.

### Claim 6 (depends on 1)

The method of claim 1, wherein the back surface consists of the first surface extending horizontally, and the second surface extending perpendicularly.

### Claim 7 (depends on 2)

The method of claim 2, wherein the back surface consists of the first surface and the second surface.