# US 12,109,664 B1 · Method for determining thickness of metal film of wafer, polishing device, and medium

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- Number: US 12,109,664 B1
- Document ID: US12109664B1
- Status: Granted
- Kind: B1
- Application number: 18/756,304
- Filed: 2024-06-27
- Granted: 2024-10-08
- Earliest claimed: 2024-01-31
- Assignees: Hwatsing (Beijing) Technology Co., Ltd.
- Applicants: Hwatsing (Beijing) Technology Co., Ltd.
- Inventors: Xinchun Lu; Yingming Wu; Fangxin Tian; Jie Liu
- Web page: https://patentgrep.com/patent/US12109664B1

## CPC

- B24B 37/005: Control means for lapping machines or devices
- B24B 49/105: {using eddy currents}
- G01B 7/105: {for measuring thickness of coating}
- G01B 15/02: for measuring thickness
- G01B 21/08: for measuring thickness
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A method for measuring a thickness of a metal film, a polishing device, and a medium are provided. The method includes: determining a reference thickness of the metal film based on measurement signals, the measurement signals being indicative of measured thicknesses of different positions on the metal film; determining sub-adjustment parameters based on an adjustment parameter included in the reference thickness, wherein the adjustment parameter includes sub-adjustment parameters corresponding to topographies of different edges of the metal film; and adjusting, based on the sub-adjustment parameters, a coordinate value of a sampling point in a to-be-processed area of the metal film, processing, based on an adjusted coordinate value, an amplitude of the signal corresponding to the sampling point in the measurement signals, and determining a thickness of the metal film based on the processed signal amplitude.

## Claims

### Claim 1

A method for measuring a thickness of a metal film of a wafer, comprising:
determining a reference thickness of the metal film based on measurement signals collected by an eddy current sensor, the measurement signals being indicative of measured thicknesses of different positions on the metal film;
determining an adjustment parameter based on the reference thickness, wherein the adjustment parameter includes sub-adjustment parameters corresponding to a flat edge topography, a topography of an upwardly bending edge, and a topography of a downwardly bending edge respectively;
adjusting, based on the sub-adjustment parameters included in the adjustment parameter, a coordinate value of a sampling point in a to-be-processed area of the metal film;
processing, based on an intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, an amplitude of a signal corresponding to the sampling point in the measurement signals; and
determining the thickness of the metal film based on the processed signal amplitude,
wherein the coordinate value of the sampling point is adjusted using the following formula:
G(p)=k*(p+b)
where, in the formula, p is the coordinate value of the sampling point in the to-be-processed area of the metal film, G(p) is the intermediate coordinate value corresponding to the sampling point, and k and b are two parameter values included in the sub-adjustment parameters; and
wherein the processing, based on the intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, the amplitude of the signal corresponding to the sampling point in the measurement signals, comprises:
determining, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, an attenuation recovery coefficient corresponding to the sampling point;
normalizing the attenuation recovery coefficient corresponding to the sampling point, to obtain an attenuation coefficient corresponding to the sampling point; and
dividing the amplitude of the signal corresponding to the sampling point by the attenuation coefficient to obtain the processed signal amplitude.

### Claim 2 (depends on 1)

The method according to claim 1, wherein the determining the reference thickness of the metal film on the wafer based on the measurement signals collected by the eddy current sensor comprises:
determining, from the measurement signals, an amplitude of a signal corresponding to a sampling point in a reference area on the metal film, wherein the reference area does not intersect the to-be-processed area;
calculating, based on the amplitude of the signal corresponding to the sampling point in the reference area, an average value of measured thicknesses corresponding to all sampling points in the reference area; and
determining a calculation result as the reference thickness.

### Claim 3 (depends on 1)

The method according to claim 1, wherein the adjusting, based on the sub-adjustment parameters included in the adjustment parameter, the coordinate value of the sampling point in the to-be-processed area of the metal film, and processing, based on the intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, the amplitude of the signal corresponding to the sampling point in the measurement signals, comprise:
determining a first sub-adjustment parameter from a plurality of sub-adjustment parameters included in the adjustment parameter, and determining a thickness difference range corresponding to the first sub-adjustment parameter;
determining the first sub-adjustment parameter as a target sub-adjustment parameter, and determining the thickness difference range corresponding to the first sub-adjustment parameter as a target thickness difference range;
adjusting, based on the target sub-adjustment parameter, the coordinate value of the sampling point in the to-be-processed area of the metal film, to obtain the intermediate coordinate value;
processing, based on the intermediate coordinate value, the amplitude of the signal corresponding to the sampling point in the measurement signals, to obtain an intermediate amplitude of the signal, and determining, based on the intermediate amplitude of the signal, a thickness corresponding to the sampling point;
when a difference between the thickness corresponding to the sampling point and the reference thickness falls within the target thickness difference range, determining the intermediate amplitude of the signal corresponding to the sampling point as the processed amplitude of the signal; and
when the difference between the thickness corresponding to the sampling point and the reference thickness falls outside the target thickness difference range, determining, based on the difference between the thickness corresponding to the sampling point and the reference thickness, a second sub-adjustment parameter from the plurality of sub-adjustment parameters included in the adjustment parameter, and determining, as the processed signal amplitude, the intermediate amplitude of the signal obtained when the second sub-adjustment parameter is used as the target sub-adjustment parameter.

### Claim 4 (depends on 3)

The method according to claim 3, wherein the first sub-adjustment parameter is a sub-adjustment parameter corresponding to the flat edge topography, and the second sub-adjustment parameter is the sub-adjustment parameter corresponding to the topography of the upwardly bending edge or the topography of the downwardly bending edge.

### Claim 5 (depends on 1)

The method according to claim 1,
wherein the determining, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, the attenuation recovery coefficient corresponding to the sampling point, comprises:
calculating, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, the attenuation recovery coefficient corresponding to the sampling point using the following formula:
F(G(p))=e{circumflex over ( )}(G(p))/(e{circumflex over ( )}(G(p))+1); and
wherein the normalizing the attenuation recovery coefficient corresponding to the sampling point, to obtain the attenuation coefficient corresponding to the sampling point, comprises:
normalizing the attenuation recovery coefficient corresponding to the sampling point using the following formula to obtain the attenuation coefficient corresponding to the sampling point:
H(p)=F(G(p))*2/(∫F(G(p)))
where, in the formulas, G(p) is the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, F(G(p)) is the attenuation recovery coefficient corresponding to the sampling point, H(p) is the attenuation coefficient corresponding to the sampling point, e{circumflex over ( )}(G(p)) represents e to the power of G(p), and ∫F(G(p)) represents integrating F(G(p)).

### Claim 6

A chemical mechanical polishing device, comprising:
a polishing platen;
a carrier head;
a slurry supply apparatus;
an eddy current sensor; and
a controller, wherein:
the carrier head is configured to load a to-be-polished wafer and press the wafer against a polishing pad arranged on the polishing platen;
the slurry supply apparatus is configured to supply slurry between the polishing pad and the wafer;
the eddy current sensor is configured to measure a reference thickness of a metal film on the wafer; and
the controller is configured to execute a method for measuring a thickness of the metal film, the method comprising:
determining the reference thickness of the metal film based on measurement signals collected by the eddy current sensor, wherein the measurement signals are indicative of measured thicknesses of different positions on the metal film;
determining an adjustment parameter based on the reference thickness, wherein the adjustment parameter comprises sub-adjustment parameters respectively corresponding to a flat edge topography, a topography of an upwardly bending edge, and a topography of a downwardly bending edge;
adjusting, based on the sub-adjustment parameters included in the adjustment parameter, a coordinate value of a sampling point in a to-be-processed area of the metal film;
processing, based on an intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, an amplitude of the signal corresponding to the sampling point in the measurement signals; and
determining the thickness of the metal film based on the processed signal amplitude,
wherein the coordinate value of the sampling point is adjusted using the following formula:
G(p)=k*(p+b)
where, in the formula, p is the coordinate value of the sampling point in the to-be-processed area of the metal film, G(p) is the intermediate coordinate value corresponding to the sampling point, and k and b are two parameter values included in the sub-adjustment parameters; and
wherein the processing, based on the intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, the amplitude of the signal corresponding to the sampling point in the measurement signals comprises:
determining, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, an attenuation recovery coefficient corresponding to the sampling point;
normalizing the attenuation recovery coefficient corresponding to the sampling point, to obtain an attenuation coefficient corresponding to the sampling point; and
dividing the amplitude of the signal corresponding to the sampling point by the attenuation coefficient to obtain the processed signal amplitude.

### Claim 7 (depends on 6)

The device according to claim 6, wherein the determining the reference thickness of the metal film based on a measurement signals collected by the eddy current sensor comprises:
determining, from the measurement signals, an amplitude of the signal corresponding to a sampling point in a reference area of the metal film, wherein the reference area does not intersect the to-be-processed area; and
calculating, based on the amplitude of the signal corresponding to the sampling point in the reference area, an average value of measured thicknesses corresponding to all sampling points in the reference area, and determining a calculation result as the reference thickness.

### Claim 8 (depends on 6)

The device according to claim 6, wherein the adjusting, based on the sub-adjustment parameters included in the adjustment parameter, the coordinate value of the sampling point in the to-be-processed area of the metal film, and processing, based on the intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, the amplitude of the signal corresponding to the sampling point in the measurement signals, comprise:
determining a first sub-adjustment parameter from a plurality of sub-adjustment parameters included in the adjustment parameter, and determining a thickness difference range corresponding to the first sub-adjustment parameter;
determining the first sub-adjustment parameter as a target sub-adjustment parameter, and determining the thickness difference range corresponding to the first sub-adjustment parameter as a target thickness difference range;
adjusting, based on the target sub-adjustment parameter, the coordinate value of the sampling point in the to-be-processed area of the metal film, to obtain the intermediate coordinate value;
processing, based on the intermediate coordinate value, the amplitude of the signal corresponding to the sampling point in the measurement signals, to obtain an intermediate amplitude of the signal, and determining, based on the intermediate amplitude of the signal, a thickness corresponding to the sampling point;
when a difference between the thickness corresponding to the sampling point and the reference thickness falls within the target thickness difference range, determining the intermediate amplitude of the signal corresponding to the sampling point as the processed signal amplitude; and
when the difference between the thickness corresponding to the sampling point and the reference thickness falls outside the target thickness difference range, determining, based on the difference between the thickness corresponding to the sampling point and the reference thickness, a second sub-adjustment parameter from the plurality of sub-adjustment parameters included in the adjustment parameter, and determining, as the processed signal amplitude, an intermediate amplitude of the signal obtained when the second sub-adjustment parameter is used as the target sub-adjustment parameter.

### Claim 9 (depends on 8)

The device according to claim 8, wherein the first sub-adjustment parameter is a sub-adjustment parameter corresponding to the flat edge topography, and the second sub-adjustment parameter is a sub-adjustment parameter corresponding to the topography of the upwardly bending edge or the topography of the downwardly bending edge.

### Claim 10 (depends on 6)

The device according to claim 6,
wherein the determining, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, the attenuation recovery coefficient corresponding to the sampling point comprises:
calculating, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, the attenuation recovery coefficient corresponding to the sampling point using the following formula:
F(G(p))=e{circumflex over ( )}(G(p))/(e{circumflex over ( )}(G(p))+1); and
wherein the normalizing the attenuation recovery coefficient corresponding to the sampling point, to obtain the attenuation coefficient corresponding to the sampling point, comprises:
normalizing the attenuation recovery coefficient corresponding to the sampling point using the following formula to obtain the attenuation coefficient corresponding to the sampling point:
H(p)=F(G(p))*2/(∫F(G(p)))
where, in the formulas, G(p) is the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, F(G(p)) is the attenuation recovery coefficient corresponding to the sampling point, H(p) is the attenuation coefficient corresponding to the sampling point, e{circumflex over ( )}(G(p)) represents e to the power of G(p), and ∫F(G(p)) represents integrating F(G(p)).

### Claim 11

A non-transitory computer storage medium storing instructions which, when executed by a processor, cause the processor to perform a method for measuring a thickness of a metal film of a wafer, the method comprises:
determining a reference thickness of the metal film based on measurement signals collected by an eddy current sensor, the measurement signals being indicative of measured thicknesses of different positions on the metal film;
determining an adjustment parameter based on the reference thickness, wherein the adjustment parameter comprises sub-adjustment parameters respectively corresponding to a flat edge topography, a topography of an upwardly bending edge, and a topography of a downwardly bending edge;
adjusting, based on the sub-adjustment parameters included in the adjustment parameter, a coordinate value of a sampling point in a to-be-processed area of the metal film;
processing, based on an intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, an amplitude of the signal corresponding to the sampling point in the measurement signals; and
determining the thickness of the metal film based on the processed signal amplitude,
wherein the coordinate value of the sampling point is adjusted using the following formula:
G(p)=k*(p+b)
where, in the formula, p is the coordinate value of the sampling point in the to-be-processed area of the metal film, G(p) is the intermediate coordinate value corresponding to the sampling point, and k and b are two parameter values included in the sub-adjustment parameters; and
wherein the processing, based on the intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, the amplitude of the signal corresponding to the sampling point in the measurement signals, comprises:
determining, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, an attenuation recovery coefficient corresponding to the sampling point;
normalizing the attenuation recovery coefficient corresponding to the sampling point, to obtain an attenuation coefficient corresponding to the sampling point; and
dividing the amplitude of the signal corresponding to the sampling point by the attenuation coefficient to obtain the processed signal amplitude.

### Claim 12 (depends on 11)

The storage medium according to claim 11, wherein the determining the reference thickness of the metal film based on measurement signals collected by an eddy current sensor comprises:
determining, from the measurement signals, an amplitude of the signal corresponding to a sampling point in a reference area of the metal film, wherein the reference area does not intersect the to-be-processed area;
calculating, based on the amplitude of the signal corresponding to the sampling point in the reference area, an average value of measured thicknesses corresponding to all sampling points in the reference area; and
determining a calculation result as the reference thickness.

### Claim 13 (depends on 11)

The storage medium according to claim 11, wherein the adjusting, based on the sub-adjustment parameters included in the adjustment parameter, the coordinate value of the sampling point in the to-be-processed area of the metal film, and processing, based on the intermediate coordinate value obtained after adjustment of the coordinate value of the sampling point, the amplitude of the signal corresponding to the sampling point in the measurement signals, comprise:
determining a first sub-adjustment parameter from a plurality of sub-adjustment parameters included in the adjustment parameter, and determining a thickness difference range corresponding to the first sub-adjustment parameter;
determining the first sub-adjustment parameter as a target sub-adjustment parameter, and determining the thickness difference range corresponding to the first sub-adjustment parameter as a target thickness difference range;
adjusting, based on the target sub-adjustment parameter, the coordinate value of the sampling point in the to-be-processed area of the metal film, to obtain the intermediate coordinate value;
processing, based on the intermediate coordinate value, the amplitude of the signal corresponding to the sampling point in the measurement signals, to obtain an intermediate amplitude of the signal, and determining, based on the intermediate amplitude of the signal, a thickness corresponding to the sampling point;
when a difference between the thickness corresponding to the sampling point and the reference thickness falls within the target thickness difference range, determining the intermediate amplitude of the signal corresponding to the sampling point as the processed signal amplitude; and
when the difference between the thickness corresponding to the sampling point and the reference thickness falls outside the target thickness difference range, determining, based on the difference between the thickness corresponding to the sampling point and the reference thickness, a second sub-adjustment parameter from the plurality of sub-adjustment parameters included in the adjustment parameter, and determining, as the processed signal amplitude, an intermediate amplitude of the signal obtained when the second sub-adjustment parameter is used as the target sub-adjustment parameter.

### Claim 14 (depends on 13)

The storage medium according to claim 13, wherein the first sub-adjustment parameter is a sub-adjustment parameter corresponding to the flat edge topography, and the second sub-adjustment parameter is a sub-adjustment parameter corresponding to the topography of the upwardly bending edge or the topography of the downwardly bending edge.

### Claim 15 (depends on 11)

The storage medium according to claim 11,
wherein the determining, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, the attenuation recovery coefficient corresponding to the sampling point comprises:
calculating, based on the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, the attenuation recovery coefficient corresponding to the sampling point using the following formula:
F(G(p))=e{circumflex over ( )}(G(p))/(e{circumflex over ( )}(G(p))+1); and
wherein the normalizing the attenuation recovery coefficient corresponding to the sampling point, to obtain the attenuation coefficient corresponding to the sampling point comprises:
normalizing the attenuation recovery coefficient corresponding to the sampling point using the following formula to obtain the attenuation coefficient corresponding to the sampling point:
H(p)=F(G(p))*2/(∫F(G(p)))
where, in the formulas, G(p) is the intermediate coordinate value corresponding to the sampling point in the to-be-processed area, F(G(p)) is the attenuation recovery coefficient corresponding to the sampling point, H(p) is the attenuation coefficient corresponding to the sampling point, e{circumflex over ( )}(G(p)) represents e to the power of G(p), and ∫F(G(p)) represents integrating F(G(p)).