# US 12,109,641 B2 · Optical device having structural and refractive index gradation, and method of fabricating the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,109,641 B2 - Document ID: US12109641B2 - Status: Granted - Kind: B2 - Application number: 17/455,288 - Filed: 2021-11-17 - Published: 2022-05-19 - Granted: 2024-10-08 - Earliest claimed: 2020-11-17 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Kang Luo; Ludovic Godet; Daihua Zhang; Nai-Wen Pi; Jinrui Guo; Rami Hourani - Web page: https://patentgrep.com/patent/US12109641B2 ## CPC - B23K 10/00: Welding or cutting by means of a plasma - G02B 6/0016: {Grooves, prisms, gratings, scattering particles or rough surfaces} - G02B 6/0036: {2-D arrangement of prisms, protrusions, indentations or roughened surfaces} - G02B 6/0065: {Manufacturing aspects; Material aspects} - B23K: SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM - G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS ## Abstract The present disclosure generally relates to a method and apparatus for forming a substrate having a graduated refractive index. A method of forming a waveguide structure includes expelling plasma from an applicator having a head toward a plurality of grating structures formed on a substrate. The plasma is formed in the head at atmospheric pressure. The method further includes changing a depth of the plurality of grating structures with the plasma by removing grating material from the plurality of grating structures. ## Claims ### Claim 1 A method of forming a waveguide structure, comprising: expelling plasma from an applicator having a head toward a plurality of grating structures formed on a substrate, the plasma formed at atmospheric pressure in the head; changing a depth of the plurality of grating structures with the plasma by removing grating material from the plurality of grating structures, and depositing an overlayer over and in contact with the grating structures and to form a surface profile of the overlayer, the surface profile having a surface angle defining a slope with respect to the substrate. ### Claim 2 (depends on 1) The method of claim 1, wherein the overlayer is deposited over and in contact with the grating structures by vaporizing a precursor with the plasma, wherein the overlayer is at least one of a photoresist layer, an encapsulating layer, or a deposition layer. ### Claim 3 (depends on 2) The method of claim 2, further comprising removing a portion of the overlayer using a plasma formed at atmospheric pressure in the head of the applicator. ### Claim 4 (depends on 1) The method of claim 1, wherein changing the depth of the plurality of grating structures comprises sloping the plurality of grating structures in a direction from a first end of the substrate to a second end of the substrate. ### Claim 5 (depends on 4) The method of claim 4, wherein a refractive index of the waveguide structure changes linearly from the first end to the second end with respect to the depth of the plurality of grating structures. ### Claim 6 (depends on 4) The method of claim 4, wherein a refractive index of the waveguide structure changes non-linearly from the first end to the second end with respect to the depth of the plurality of grating structures. ### Claim 7 (depends on 4) The method of claim 4, wherein a refractive index of the waveguide structure oscillates from the first end to the second end with respect to the depth of the plurality of grating structures. ### Claim 8 (depends on 1) The method of claim 1, further comprising: creating a second surface profile by moving the head of the applicator relative to the plurality of grating structures; and removing grating material from the plurality of grating structures, based upon data representing a target profile. ### Claim 9 (depends on 2) The method of claim 2, wherein the surface profile of the overlayer is varied by varying at least one of a plasma power, a distance from the head of the applicator to a surface of the substrate, or a relative speed between the head and the surface of the substrate. ### Claim 10 (depends on 1) The method of claim 1, further comprising: creating a second surface profile by moving the head of the applicator relative to the plurality of grating structures; and depositing material over the grating structures, based upon data representing a target profile. ### Claim 11 A method of forming a waveguide structure, comprising: expelling plasma from an applicator having a head toward a plurality of grating structures formed on a substrate, the plasma formed at atmospheric pressure in the head; depositing a layer over the plurality of grating structures by vaporizing a precursor with the plasma formed in the head; removing portions of the layer using a plasma from the applicator at atmospheric pressure to form a surface profile of the layer; and etching the plurality of grating structures through the layer. ### Claim 12 (depends on 11) The method of claim 11, wherein the surface profile of the layer is varied by varying at least one of a plasma power, a distance from the head of the applicator to a surface of the substrate, or a relative speed between the head and the surface of the substrate. ### Claim 13 (depends on 12) The method of claim 12, wherein the layer is formed from the precursor selected from a group containing one or more of (N2), nitrogen dioxide (NO2), fluorine gas (F2), oxygen gas (O2), hydrogen gas (H2), H2O in vapor form, carbon monoxide (CO), methane (CH4), carbon dioxide (CO2), argon (Ar), and helium (He). ### Claim 14 (depends on 11) The method of claim 11, wherein the surface profile of the layer is varied by varying at least one of a plasma power, a distance from the head of the applicator to a surface of the substrate, or a relative speed between the head and the surface of the substrate. ### Claim 15 A method of forming a waveguide structure, comprising: expelling plasma from an applicator having a head toward a substrate, the plasma formed at atmospheric pressure in the head; depositing one or more refractive layers over the substrate by vaporizing a precursor with the plasma formed in the head; depositing an overlayer on the one or more refractive layers; and forming a refractive grating structure by etching the one or more refractive layers through the overlayer. ### Claim 16 (depends on 15) The method of claim 15, further comprising: forming a plurality of gratings and a plurality of channels of the refractive grating structure by etching the channels in the one or more refractive layers. ### Claim 17 (depends on 15) The method of claim 15, wherein the precursor is selected from a group containing one or more of (N2), nitrogen dioxide (NO2), fluorine gas (F2), oxygen gas (O2), hydrogen gas (H2), H2O in vapor form, carbon monoxide (CO), methane (CH4), carbon dioxide (CO2), argon (Ar), and helium (He). ### Claim 18 (depends on 16) The method of claim 16, wherein a change in depth of the plurality of gratings has a surface profile with a slope surface angle that changes linearly from a first end to a second end of the refractive grating structure. ### Claim 19 (depends on 15) The method of claim 15, further comprising: forming a plurality of gratings and a plurality of channels of the refractive grating structure by etching the channels in the one or more refractive layers, wherein the plurality of gratings are formed at an angle between 5 degrees and 65 degrees with respect to the substrate. ### Claim 20 (depends on 9) The method of claim 9, wherein the head includes a nozzle having one or more openings. ### Claim 21 (depends on 1) The method of claim 1, wherein the surface angle includes a non-linear gradation. ### Claim 22 A method of forming a waveguide structure, comprising: expelling plasma from an applicator having a head toward a plurality of grating structures formed on a substrate, the plasma formed at atmospheric pressure in the head; depositing a layer over the plurality of grating structures by vaporizing a precursor with the plasma formed in the head; and removing portions of the layer using a plasma from the applicator at atmospheric pressure to form a surface profile of the layer, the surface profile having a surface angle. ### Claim 23 (depends on 22) The method of claim 22, wherein the surface profile of the layer is varied by varying at least one of a plasma power, a distance from the head of the applicator to a surface of the substrate, or a relative speed between the head and the surface of the substrate. ### Claim 24 (depends on 22) The method of claim 22, wherein the layer is formed from the precursor selected from a group containing one or more of (N2), nitrogen dioxide (NO2), fluorine gas (F2), oxygen gas (O2), hydrogen gas (H2), H2O in vapor form, carbon monoxide (CO), methane (CH4), carbon dioxide (CO2), argon (Ar), and helium (He). ### Claim 25 (depends on 24) The method of claim 24, wherein the surface profile of the layer is varied by varying at least one of a plasma power, a distance from the head of the applicator to a surface of the substrate, or a relative speed between the head and the surface of the substrate.