# US 12,109,597 B2 · Substrate treatment device

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- Number: US 12,109,597 B2
- Document ID: US12109597B2
- Status: Granted
- Kind: B2
- Application number: 17/230,152
- Filed: 2021-04-14
- Published: 2021-10-21
- Granted: 2024-10-08
- Earliest claimed: 2020-04-15
- Assignees: Shibaura Mechatronics Corporation
- Applicants: Shibaura Mechatronics Corporation
- Inventors: Daisuke Matsushima; Kensuke Demura; Satoshi Nakamura; Masaya Kamiya; Minami Nakamura
- Web page: https://patentgrep.com/patent/US12109597B2

## CPC

- B08B 7/0014: {by incorporation in a layer which is removed with the contaminants}
- H10P 72/0434: {mainly by convection}
- B08B 3/041: {Cleaning travelling work}
- B08B 3/08: the liquid having chemical or dissolving effect
- B08B 3/10: with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- F25C 1/12: by freezing water on cooled surfaces, e.g. to form slabs
- H10P 72/0414: {using mainly spraying means, e.g. nozzles}
- H10P 72/0406: {for cleaning followed by drying, rinsing, stripping, blasting or the like}
- B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- F25C: PRODUCING, WORKING OR HANDLING ICE

## Abstract

According to one embodiment, a substrate treatment device includes a placement stand configured to rotate the substrate, a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate, a first liquid supplier configured to supply a first liquid on a surface of the substrate, a second liquid supplier configured to supply a second liquid on the surface, and a controller controlling rotation of the substrate, supply of the cooling gas, the first and second liquids. The controller performs a preliminary process of supplying the second liquid on the surface, and supplying the cooling gas into the space, a liquid film forming process by supplying the first liquid toward the surface after the preliminary process, a supercooling process of the liquid film on the surface, and a freezing process of at least a part of the liquid film on the surface.

## Claims

### Claim 1

A substrate treatment device, comprising:
a placement stand configured to rotate the substrate, the substrate including a first surface and a second surface opposite the first surface, the first surface facing the placement stand;
a cooling part configured to supply a cooling gas into a space between the placement stand and the substrate;
a first liquid supplier configured to supply a first liquid on the second surface of the substrate;
a second liquid supplier configured to supply a second liquid on the second surface of the substrate, the second liquid being more conductive than the first liquid; and
a controller controlling rotation of the substrate, supply of the cooling gas, supply of the first liquid, and supply of the second liquid,
the controller being configured to perform following steps;
a preliminary step of supplying the second liquid on the second surface of the substrate, a temperature of the second liquid being higher than a freezing point of the first liquid, and supplying the cooling gas into the space between the placement stand and the substrate,
a liquid film forming step of forming a liquid film by supplying the first liquid toward the second surface of the substrate after the preliminary step,
a supercooling step of putting the liquid film on the second surface of the substrate in a supercooled state, and
a freezing step of freezing at least a part of the liquid film on the second surface of the substrate,
in the liquid film forming step,
after stopping the supply of the second liquid,
rotating the substrate at a rotational speed of the preliminary step to discharge at least a part of the second liquid supplied to the second surface of the substrate,
after discharging at least part of the second liquid, setting a first rotational speed slower than the rotational speed in the preliminary step, and then supplying the first liquid toward the second surface of the substrate, and
in the freezing step, the liquid film has a layer comprising only the first liquid if the second liquid is completely discharged in the liquid film forming step, or the liquid film has a layer comprising the first liquid and the second liquid if a part of the second liquid is left in the liquid film forming step.

### Claim 2 (depends on 1)

The device according to claim 1, wherein
the controller further performs a thawing process of thawing the frozen liquid film by supplying the second liquid to the frozen liquid film on the second surface of the substrate.

### Claim 3 (depends on 1)

The device according to claim 1, wherein
the second liquid contains a gas that is ionized when dissolved therein.

### Claim 4 (depends on 3)

The device according to claim 3, wherein
the gas that is ionized is carbon dioxide gas or ammonia gas.

### Claim 5 (depends on 4)

The device according to claim 4, wherein
the second liquid is water in which the gas is dissolved.

### Claim 6 (depends on 5)

The device according to claim 5, wherein
the first liquid is pure water.

### Claim 7 (depends on 1)

The device according to claim 1, wherein
the second liquid supplier includes a nozzle discharging the second liquid, and a discharge port of the second liquid of the nozzle faces a center of the second surface of the substrate.

### Claim 8 (depends on 7)

The device according to claim 7, wherein
the first liquid supplier supplies the first liquid to the second surface of the substrate by using the nozzle included in the second liquid supplier.