# US 12,109,580 B2 · Processing liquid nozzle and cleaning apparatus > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 12,109,580 B2 - Document ID: US12109580B2 - Status: Granted - Kind: B2 - Application number: 17/763,371 - Filed: 2020-09-14 - Published: 2022-11-24 - Granted: 2024-10-08 - Earliest claimed: 2019-09-25 - Assignees: Tokyo Electron Limited - Applicants: Tokyo Electron Limited - Inventors: Daisuke Goto; Katsuhiro Morikawa; Takahiro Koga - Web page: https://patentgrep.com/patent/US12109580B2 ## CPC - B05B 17/0676: {Feeding means} - B08B 3/02: Cleaning by the force of jets or sprays - B05B 7/0408: {with arrangements for mixing two or more liquids} - B05B 15/52: for removal of clogging particles - B05B 15/58: preventing deposits, drying-out or blockage by recirculating the fluid to be sprayed from upstream of the discharge opening back to the supplying means {(B05B1/3093 takes precedence)} - B05B 17/0607: {generated by electrical means, e.g. piezoelectric transducers} - B08B 3/022: {Cleaning travelling work (B08B3/042 takes precedence)} - B08B 3/08: the liquid having chemical or dissolving effect - B08B 3/123: {Cleaning travelling work, e.g. webs, articles on a conveyor (conveyors B65G; handling webs B65H)} - B08B 5/02: Cleaning by the force of jets, e.g. blowing-out cavities {(airguns or nozzles per se B05B1/005)} - B08B 5/04: Cleaning by suction, with or without auxiliary action - B08B 13/00: Accessories or details of general applicability for machines or apparatus for cleaning - H10P 52/00: Grinding, lapping or polishing of wafers, substrates or parts of devices - B05B 7/0018: {with devices for making foam} - B05B 7/2486: {with means for supplying liquid or other fluent material to several discharge devices} - B08B 2203/0217: Use of a detergent in high pressure cleaners; arrangements for supplying the same - B08B 2203/0288: Ultra or megasonic jets - B05B: SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES (spray-mixers with nozzles B01F25/72; processes for applying liquids or other fluent materials to surfaces by spraying B05D) - B08B: CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 ## Abstract A processing liquid nozzle includes: an ultrasonic wave generator including a oscillator that generates ultrasonic waves and a oscillating body that is joined to the oscillator; a first supply flow path configured to supply a first liquid to a position in contact with the oscillating body of the ultrasonic wave generator; an ejection flow path configured to supply the first liquid to which the ultrasonic waves are applied by the ultrasonic wave generator to an ejection port; and a second supply flow path connected to the ejection flow path on a downstream side from the ultrasonic wave generator and configured to supply a second liquid to the ejection flow path. ## Claims ### Claim 1 A processing liquid nozzle comprising: an ultrasonic wave generator including an oscillator that generates ultrasonic waves and an oscillating body that is connected to the oscillator; a first supply flow path configured to supply a first liquid to a point contacting the oscillating body of the ultrasonic wave generator; an ejection flow path configured to supply the first liquid to which the ultrasonic waves are applied by the ultrasonic wave generator to an ejection port; and a second supply flow path connected to the ejection flow path on a downstream side from the ultrasonic wave generator and configured to supply a second liquid to the ejection flow path, wherein the oscillating body is provided at an upstream end of the ejection flow path and extends into the ejection flow path such that the first supply flow path directly supplies the first liquid to the point contacting the oscillating body upon exiting the first supply flow path. ### Claim 2 (depends on 1) The processing liquid nozzle according to claim 1, wherein the first liquid has a strong acidity or a relatively strong alkalinity, and the second liquid has an effervescent property. ### Claim 3 (depends on 1) The processing liquid nozzle according to claim 1, wherein, in the ejection flow path, a length from a connection portion between the ejection flow path and the first supply flow path to a connection portion between the ejection flow path and the second supply flow path is equal to or larger than a diameter of the ejection port. ### Claim 4 (depends on 1) The processing liquid nozzle according to claim 1, wherein, in the ejection flow path, a length from a connection portion between the ejection flow path and the second supply flow path to the ejection port is equal to or larger than the diameter of the ejection port. ### Claim 5 (depends on 1) The processing liquid nozzle according to claim 1, wherein an inner diameter of the ejection flow path is equal to the diameter of the ejection port. ### Claim 6 (depends on 1) The processing liquid nozzle according to claim 1, wherein an inner diameter of an upstream side of the ejection flow path is larger than the diameter of the ejection port. ### Claim 7 (depends on 1) The processing liquid nozzle according to claim 1, wherein, when viscosity of the first liquid is larger than viscosity of the second liquid, in the ejection flow path, a length from a connection portion between the ejection flow path and the second supply flow path to the ejection port is longer than a length from a connection portion between the ejection flow path and the first supply flow path to the connection portion between the ejection flow path and the second supply flow path. ### Claim 8 (depends on 1) The processing liquid nozzle according to claim 1, wherein, when a flow rate of the first liquid is larger than a flow rate of the second liquid, in the ejection flow path, a length from a connection portion between the ejection flow path and the first supply flow path to a connection portion between the ejection flow path and the second supply flow path is longer than a length from the connection portion between the ejection flow path and the second supply flow path to the ejection port. ### Claim 9 (depends on 1) The processing liquid nozzle according to claim 1, wherein a supply pressure of the first liquid is larger than a supply pressure of the second liquid. ### Claim 10 (depends on 1) The processing liquid nozzle according to claim 1, wherein, when reaction heat is generated when the first liquid and the second liquid are mixed, in the ejection flow path, a length from a connection portion between the ejection flow path and the first supply flow path to a connection portion between the ejection flow path and the second supply flow path is longer than a length from the connection portion between the ejection flow path and the second supply flow path to the ejection port. ### Claim 11 (depends on 1) The processing liquid nozzle according to claim 1, further comprising: a third supply flow path connected to the first supply flow path or an upstream side of the connection portion between the ejection flow path and the second supply flow path, and configured to supply a third liquid. ### Claim 12 (depends on 1) The processing liquid nozzle according to claim 1, further comprising: a destaticizer configured to destaticize a mixed liquid ejected from the ejection port. ### Claim 13 (depends on 1) A cleaning apparatus comprising: the processing liquid nozzle according to claim 1; and a substrate processing unit including a substrate holder that holds a substrate and a column that rotates the substrate holder. ### Claim 14 (depends on 13) The cleaning apparatus according to claim 13, further comprising: a dummy dispense bath provided at a standby position of the processing liquid nozzle, wherein the dummy dispense bath includes a suction nozzle that sucks a liquid adhering to the ejection port. ### Claim 15 (depends on 14) The cleaning apparatus according to claim 14, further comprising: a controller configured to control each part of the cleaning apparatus, wherein, before processing the substrate by the substrate processing unit, the controller causes the suction nozzle to suck the liquid adhering to the ejection port of the processing liquid nozzle standing by in the dummy dispense bath. ### Claim 16 (depends on 13) The cleaning apparatus according to claim 13, further comprising: a dummy dispense bath provided at a standby position of the processing liquid nozzle, wherein the dummy dispense bath includes an air blower that air-blows the liquid adhering to the ejection port. ### Claim 17 (depends on 16) The cleaning apparatus according to claim 16, further comprising: a controller that controls each part of the cleaning apparatus, wherein, before the substrate is processed by the substrate processing unit, the controller causes the air blower to air-blow the liquid adhering to the ejection port of the processing liquid nozzle standing by in the dummy dispense bath.