Processing apparatus and processing method
AssigneeTokyo Electron Limited
InventorYohei Yamashita
Life of this patent
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Abstract
In forming modification layers by radiating laser light to an inside of a processing target object from a modifying device periodically while rotating the processing target object held by a holder relative to the modifying device by a rotating mechanism and by moving the modifying device relative to the holder in a diametrical direction by a moving mechanism, a boundary position of the laser light in the diametrical direction is calculated, the boundary position being a position where a circumferential distance between the modification layers becomes a required threshold value, and a diametrical distance between the modification layers is reduced in a moving direction of the modifying device from the boundary position and/or a frequency of the laser light is reduced.
Claims14
A processing apparatus configured to process a processing target object, comprising:
- a holder configured to hold the processing target object;
- a laser head configured to radiate laser light to an inside of the processing target object held by the holder to form modification layers along a plane direction thereof;
- a rotating mechanism configured to rotate the holder and the laser head relatively;
- a moving mechanism configured to move the holder and the laser head relatively in a horizontal direction;
- and
- a controller configured to control the holder, the laser head, the rotating mechanism and the moving mechanism,
- wherein, the modification layers are formed by radiating the laser light to the inside of the processing target object from the laser head periodically while rotating the processing target object held by the holder relative to the laser head by the rotating mechanism and by moving the laser head relative to the holder in a diametrical direction by the moving mechanism,
- the controller calculates a boundary position of the laser light in the diametrical direction, the boundary position being a position where a circumferential distance between the modification layers becomes a required threshold value, and
- the controller controls the holder, the laser head, the rotating mechanism and the moving mechanism to reduce, in a moving direction of the laser head from the boundary position, a diametrical distance between the modification layers and/or to reduce a frequency of the laser light.
A processing method of processing a processing target object, comprising:
- holding the processing target object with a holder;
- forming modification layers in a plane direction by periodically radiating laser light to an inside of the processing target object from a laser head configured to radiate the laser light while rotating the processing target object held by the holder relative to the laser head and by moving the laser head relative to the holder in a diametrical direction,
- wherein, in the forming of the modification layers, a boundary position of the laser light in the diametrical direction is calculated such that a circumferential distance between the modification layers becomes a required threshold value, and
- in a moving direction of the laser head from the boundary position, a diametrical distance between the modification layers and/or a frequency of the laser light is reduced.
Dependencies are inferred from the claim text.