Organic electronic device including encapsulation layer
AssigneeLG Chem, Ltd.
InventorsHyun Jee Yoo, Hyun Suk Kim, Jung Ok Moon, Se Woo Yang
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AssigneeLG Chem, Ltd.
InventorsHyun Jee Yoo, Hyun Suk Kim, Jung Ok Moon, Se Woo Yang
Estimating the term…
An organic electronic device including a substrate, an organic electronic element formed on the substrate, and an encapsulation film encapsulating the organic electronic element. The organic electronic element includes a transparent electrode formed on the substrate, and a light emitting organic material layer formed on the transparent electrode. The light emitting organic material layer includes a hole transport layer, an emitting layer and an electron transport layer. The encapsulation film includes a pressure-sensitive adhesive layer. The pressure-sensitive adhesive layer includes a pressure-sensitive adhesive composition or a crosslinked product thereof. The pressure-sensitive adhesive composition includes a polymer derived from butylene, and has a Mooney viscosity (η*) of 5000 Pa·s to 107 Pa·s measured by a shear stress using a planar jig having a diameter of 8 mm at a strain of 5%, a frequency of 1 Hz and any one temperature point in the range of 30° C. to 150° C.
An organic electronic device, comprising:
Dependencies are inferred from the claim text.