Rigid flexible printed circuit board and electronic device including the same

A rigid flexible printed circuit board (RFPCB), comprising:

• a first base conductive layer;
• a first rigid conductive layer spaced apart from the first base conductive layer in a first direction;
• a second rigid conductive layer spaced apart from the first base conductive layer in the first direction and spaced apart from the first rigid conductive layer in a second direction intersecting the first direction;
• a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than to the first rigid conductive layer and the second rigid conductive layer;
• a transmission line positioned between the first base conductive layer and the base cover layer;
• and
• a dummy metal layer disposed on the base cover layer, positioned between the first rigid conductive layer and the second rigid conductive layer, and overlapping the transmission line in the first direction.

An electronic device comprising a rigid flexible printed circuit board (RFPCB), wherein the RFPCB comprises:

• a first base conductive layer;
• a second base conductive layer spaced apart from the first base conductive layer in a first direction;
• a dielectric positioned between the first base conductive layer and the second base conductive layer;
• a first rigid conductive layer positioned on an opposite side of the first base conductive layer with respect to the second base conductive layer;
• a second rigid conductive layer spaced apart from the first rigid conductive layer in a second direction intersecting the first direction;
• a base cover layer spaced apart from the first base conductive layer in the first direction and positioned closer to the first base conductive layer than to the first rigid conductive layer and the second rigid conductive layer;
• a transmission line positioned between the first base conductive layer and the base cover layer;
• a plurality of first conductive vias connecting the first base conductive layer and the first rigid conductive layer;
• a plurality of second conductive vias connecting the second base conductive layer and the second rigid conductive layer;
• and
• a dummy metal layer positioned between the first rigid conductive layer and the second rigid conductive layer, positioned between the first conductive vias and the second conductive vias, and overlapping the transmission line in the first direction.