Temperature-reporting oscillator

An integrated circuit device comprising:

• one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
• a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
• circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
• storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
• wherein the circuitry is further to
• generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
• provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits;
• and
• wherein
• the MEMS resonator is a first MEMS resonator, the resonant frequency is a first resonant frequency, and the temperature-dependent variation is a first temperature-dependent variation,
• the integrated circuit device further comprises a second MEMS resonator, wherein the second MEMS resonator is to exhibit a second resonant frequency which has a second temperature-dependent variation, and
• the circuitry is to generate the digital signal dependent on a relationship between the first resonant frequency and the second resonant frequency.

An integrated circuit device comprising:

• one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
• a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
• circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
• storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
• wherein the circuitry is further to
• generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
• provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits;
• and
• wherein
• the integrated circuit device comprises a first die, a second die and a thermally-conductive fill material directly connecting a surface of the first die with a surface of the second die,
• the MEMS resonator is on the first die, and
• the circuitry is on the second die.

An integrated circuit device comprising:

• one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits, wherein a contact of the one or more contacts is to receive an externally-supplied, run-time control signal;
• a microelectromechanical-system (MEMS) resonator, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
• circuitry, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
• storage for polynomial coefficients that describe a temperature-dependent adjustment curve to be applied to the clock signal;
• wherein the circuitry is further to
• generate a digital signal representing a sensed temperature of operation of the MEMS resonator,
• provide the digital signal via a contact of the one or more external electrical contacts to the one or more other integrated circuits, and
• provide the polynomial coefficients, via a contact of the one or more external electrical contacts, to the one or more other integrated circuits, as a function of the externally-supplied, run-time control signal;
• and
• wherein the digital signal is also output as a serial binary signal, via a single contact of the one or more external electrical contacts.

An integrated circuit device comprising:

• one or more external electrical contacts, the external electrical contacts to electrically connect the integrated circuit device to one or more other integrated circuits;
• a first die and a second die;
• a microelectromechanical-system (MEMS) resonator on the first die, wherein the MEMS resonator is to exhibit a resonant frequency which has a temperature-dependent variation;
• a fill material coupling a surface of the first die with a surface of the second die;
• circuitry, on the second die, the circuitry to transmit to the one or more other integrated circuits, via a contact of the one or more external electrical contacts, a clock signal, the clock signal being derived from the resonant frequency;
• programmable storage, on the second die, for polynomial coefficients that describe an empirically-measured temperature-dependent adjustment curve to be applied to the clock signal;
• wherein the circuitry is further to
• generate a digital signal representing a sensed temperature of operation of the MEMS resonator, and
• provide each of the digital signal and the polynomial coefficients, each via a contact of the one or more external electrical contacts, to the one or more other integrated circuits.