Semiconductor package structure
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChang-Yu Lin, Cheng-Hsuan Wu
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Abstract
A semiconductor package structure and a method of manufacturing a semiconductor package structure are provided. The semiconductor package structure includes a first electronic device and a second electronic device. The first electronic device has an active surface and a lateral surface angled with the active surface, and the lateral surface includes a first portion and a second portion that is non-coplanar with the first portion. The second electronic device is disposed on the active surface of the first electronic device.
Claims19
A semiconductor package structure, comprising:
- an electronic device having a first active surface;
- and
- a photonic device having a second active surface facing to and disposed on the first active surface of the electronic device,
- wherein the photonic device has a first sidewall and a second sidewall opposite to the first sidewall, the first sidewall defines a space configured to connect to an optical component, the first sidewall does not overlap the electronic device in a cross-sectional view perspective, and the second sidewall overlaps the electronic device in the cross-sectional view perspective.
A semiconductor package structure, comprising:
- a photonic device having an active surface and a first sidewall angled with the active surface, the first sidewall comprising a recess structure proximal to the active surface and configured to accommodate a first optical component;
- and
- an electronic device disposed under the active surface of the photonic device, wherein the electronic device comprises a semiconductor substrate and a through silicon via passing through the semiconductor substrate and electrically connected to the photonic device, the through silicon via comprises a conductive layer, and at least a portion of the conductive layer extends over a bottom surface of the semiconductor substrate.
A semiconductor package structure, comprising:
- a photonic device having an active surface and a first sidewall angled with the active surface, the first sidewall comprising a recess structure proximal to the active surface and configured to accommodate a first optical component;
- an electronic device disposed under the active surface of the photonic device, wherein the electronic device comprises a semiconductor substrate and a through silicon via passing through the semiconductor substrate and electrically connected to the photonic device;
- and
- a redistribution layer disposed between the photonic device and the semiconductor substrate, wherein the redistribution layer comprises a conductive trace electrically connected to the through silicon via and the photonic device.
Dependencies are inferred from the claim text.