Low temperature bonded structures
AssigneeAdeia Semiconductor Bonding Technologies Inc.
InventorsCyprian Emeka Uzoh, Jeremy Alfred Theil, Rajesh Katkar, Guilian Gao, Laura Wills Mirkarimi
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Abstract
Devices and techniques including process steps make use of recesses in conductive interconnect structures to form reliable low temperature metallic bonds. A fill layer is deposited into the recesses prior to bonding. First conductive interconnect structures are bonded at ambient temperatures to second metallic interconnect structures using direct bonding techniques, with the fill layers in the recesses in one or both of the first and second interconnect structures.
Claims13
A microelectronic assembly, comprising:
- a first substrate having a first bonding surface;
- a second substrate having a second bonding surface, the second bonding surface bonded to the first bonding surface;
- and
- a bonded conductive interconnect disposed at the first bonding surface and the second bonding surface, the bonded conductive interconnect comprising at least a first conductive material, a second conductive material, and a conductive mass comprising a combination of materials including a third conductive material, disposed between the first conductive material and the second conductive material, wherein a concentration of the third conductive material is non-linear within the conductive mass.
A microelectronic assembly, comprising:
- a first substrate having a first surface with a first conductive material embedded therein;
- a second substrate having a second surface with a second conductive material embedded therein, the first surface bonded to the second surface;
- and
- an electrically conductive mass coupling the first conductive material to the second conductive material, wherein the conductive mass includes the first conductive material, the second conductive material, and a third conductive material, and wherein a concentration of the first material, the second material, and the third material is non-linear within the conductive mass.
Dependencies are inferred from the claim text.