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US 12,098,238 B2Granted
Curable resin, curable resin composition, cured product, electronic device, laminated board material, electronic component encapsulant, and method for producing curable resin
AssigneeCentral Glass Company, Limited
InventorsKensuke Hirotaki, Hirokatsu Nagura, Kenji Hosoi, Yukari Hara
Life of this patent
Estimating the term…
Abstract
A curable resin represented by General Formula (1). In General Formula (1), R1 each independently represent a monovalent substituent (an alkyl group, an alkoxy group, a fluorine atom, and the like), m is 0 to 4, n is 0 to 40, and R2's are each independently a monovalent group including a polymerizable functional group.
Claims23
A curable resin represented by General Formula (1),
- in General Formula (1),
- R1 each independently represent a monovalent substituent,
- m is 0 to 4,
- n is 0 to 40, and
- R2's are each independently a monovalent group including a polymerizable functional group,
- wherein R2 is a monovalent group including an epoxy group or a monovalent group including an ethylenically unsaturated group.
3 more elements
Dependencies are inferred from the claim text.