Imprint apparatus and method for manufacturing article
AssigneeCanon Kabushiki Kaisha
InventorsShigeru Terashima, Takahiro Nakayama, Yoichi Matsuoka
Life of this patent
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Abstract
An imprint apparatus that forms a pattern of an imprint material on a substrate with use of a mold includes a mold holding unit configured to hold the mold, a suction unit provided at the mold holding unit and configured to suction a gas in a space in which the mold and the substrate face each other, a detector configured to detect particles included in the gas suctioned by the suction unit, and a control unit configured to perform error processing depending on a result of detection performed by the detector.
Claims10
A method of controlling an imprint apparatus that forms a pattern of an imprint material on a substrate with use of a mold, the imprint apparatus comprising:
- a control unit configured with a programmable logic device, an application specific integrated circuit, a general-purpose computer, or a combination thereof;
- a mold holding unit configured to hold the mold;
- a suction unit provided at the mold holding unit and configured to suction a gas in a space in which the mold and the substrate face each other;
- and
- a detector configured to detect particles included in the gas suctioned by the suction unit,
- wherein the detector includes a particle counter configured to count a number of particles included in the gas suctioned by the suction unit,
- the method comprising:
- actuating the control unit to control the detector to use the particle counter to count the number of particles included in the gas suctioned by the suction unit;
- actuating the control unit to determine whether the number of particles counted by the particle counter is larger than a first numerical value;
- actuating the control unit to perform error processing including executing processing to issue a warning in a case where it is determined that the number of particles counted by the particle counter is larger than the first numerical value, and
- actuating the control unit to perform error processing including executing processing to stop processing of forming the pattern of the imprint material on the substrate by the imprint apparatus in a case where it is determined that the number of particles counted by the particle counter is larger than a second numerical value, which is larger than the first numerical value.
A method of controlling a molding apparatus that molds a composition on a substrate with use of a mold, the molding apparatus comprising:
- a control unit configured with a programmable logic device, an application specific integrated circuit, a general-purpose computer, or a combination thereof;
- a mold holding unit configured to hold the mold;
- a suction unit provided at the mold holding unit and configured to suction a gas in a space in which the mold and the substrate face each other;
- and
- a detector configured to detect particles included in the gas suctioned by the suction unit,
- wherein the detector includes a particle counter configured to count a number of particles included in the gas suctioned by the suction unit,
- the method comprising:
- actuating the control unit to control the detector to use the particle counter to count the number of particles included in the gas suctioned by the suction unit;
- actuating the control unit to determine whether the number of particles counted by the particle counter is larger than a first numerical value;
- actuating the control unit to determine whether the number of particles counted by the particle counter is larger than a second numerical value, which is larger than the first numerical value;
- actuating the control unit to perform error processing including executing processing to issue a warning in a case where it is determined that the number of particles counted by the particle counter is larger than the first numerical value, and
- actuating the control unit to perform error processing including executing processing to stop processing of molding operation of the composition on the substrate by the molding apparatus in a case where it is determined that the number of particles measured by the particle counter is larger than the second numerical value.
Dependencies are inferred from the claim text.