Power semiconductor arrangement having a cover facility and method for releasing it

A method, for the release of a first opening of a housing of a power semiconductor arrangement, comprising the steps of:

• providing said power semiconductor arrangement, having a switching facility, further comprising:
• a housing having a load connection facility for connecting in an electrically conductive manner to an external supply line and having a first plug-in connecting facility for plug-in connecting to an external second plug-in connecting facility;
• the housing has a first opening through which a connecting facility for connecting the load connection facility and the associated external supply line is accessible;
• a cover facility for covering the first opening is arranged on the housing in such a manner as to be mechanically movable from a first end position into a second end position and has a first locking facility which cooperates functionally with the external second plug-in connecting facility;
• and
• whereby the first opening is closed with the cover facility as long as it is in its first end position, as long as the external second plug-in connecting facility is inserted into the first plug-in connecting facility;
• and
• wherein, starting from the arrangement of the external, second plug-in connecting facility in the first plug-in connecting facility, it is first necessary to cancel this arrangement in order to move the cover facility and thus release the first opening;
• and
• the cover facility has a second locking facility which can only be released if the arrangement of the external second plug-in connecting facility in the first plug-in connecting facility is cancelled and only after the subsequent release of the second locking facility can the cover facility be moved and thus the first opening can be released;
• and
• the second locking facility cooperates with the housing, whereby the cover facility cannot be moved as long as the second locking facility is connected in a non-positive or positive-locking manner to the housing.