Apparatus and method for transferring electronic components from a first carrier to a second carrier

An apparatus for transferring electronic components from a first carrier to a second carrier, wherein

• the first carrier carries a plurality of individual components detachably therefrom, and
• the second carrier carries, in a longitudinal extension, a plurality of electronic subassemblies, and wherein the apparatus comprises:
• a first receptacle configured to receive said first carrier;
• a second receptacle configured to guide said second carrier along the longitudinal extension in a conveying direction of said second carrier, wherein the first receptacle is configured to receive the first carrier such that the components are oriented towards the second receptacle and the second receptacle has a contact surface that is curved in the conveying direction of the second carrier;
• a separating device configured to separate the components from the first carrier in a contacting or non-contacting manner so as to transfer the components to the second carrier;
• a conveying device for the second carrier provided with the second receptacle, wherein the conveying device is configured to convey the second carrier in a position relative to a placement position in response to information signalled by a control unit, that an electronic subassembly on the second carrier reaches the placement position on the second receptacle;
• and
• a heating device configured for tempering the second carrier before, at or after the placement position from a side remote from the first receptacle by control of the heating device by the control unit as a function of material properties, a melting point of contact points of the component to be transferred and/or the material properties, the melting point of contact points of the electronic subassembly on the second carrier, wherein the heating device is a heating strip with one or more heating zones to be heated to different temperatures, said heating strip a shape at least partially following a contour of the second receptacle and which is configured to heat the second carrier.