Composition for dissolving abrasive particles and cleaning method using the same

A composition for dissolving abrasive particles, the composition comprising:

• a sulfur-containing organic acid;
• a fluorine ion-containing compound;
• a solvent;
• and
• a sulfur-containing compound,
• wherein a turbidity change rate (%) measured at 60° C. for 15 minutes is in a range of −80 to −99,
• wherein the sulfur-containing organic acid comprises at least one selected from a group consisting of sulfenic acid (RSOH), sulfinic acid (RSO(OH)), organic sulfonic acid (RS(═O)2—OH), thiosulfonic acid (RSO2SH), and thiocarboxylic acid (RC(S)OH), and
• wherein the sulfur-containing compound comprises at least one selected from a group consisting of thiosulfuric acid (H2S2O3), sulfuric acid, sulfide, bisulfide (R—S—S—R′), hydrogen sulfide (H2S), sulfur trioxide (SO3), sulfamic acid, mercaptan (R—SH), and sulfonate, and
• wherein the sulfur-containing compound is included in an amount of 5 wt % to 15 wt % in the composition, and
• wherein a mass ratio of the sulfur-containing compound:the sulfur-containing organic acid is in a range of 2:1 to 5:1, and
• wherein the composition is used to dissolve abrasive particles remaining after polishing using a chemical mechanical polishing (CMP) slurry containing abrasive particles.