Resin composition, prepreg, metal foil-clad laminate, resin sheet, and printed wiring board

A resin composition comprising:

• a maleimide compound (A),
• a cyanate ester compound (B), and
• a polyphenylene ether compound (C) with a number average molecular weight of not lower than 1000 and not higher than 7000,
• a block copolymer (D) comprising a styrene backbone, and
• a styrene oligomer (E),
• wherein
• the polyphenylene ether compound (C) is represented by Formula (1):
• in Formula (1), X represents an aryl group;
• —(Y—O)n2- represents a polyphenylene ether moiety;
• R1, R2, and R3 each independently represent a hydrogen atom, an alkyl group, an alkenyl group, or an alkynyl group;
• n2 represents an integer of from 1 to 100;
• n1 represents an integer of from 1 to 6;
• and n3 represents an integer of from 1 to 4,
• a content of the polyphenylene ether compound (C) in the resin composition is not less than 5 parts by mass, and not more than 30 parts by mass, relative to 100 parts by mass of resin solid component of the resin composition,
• the resin composition does not include phosphazene as a flame retardant, and
• a total amount of a polyphenylene ether compound other than the polyphenylene ether compound (C) and an additional thermoplastic elastomer is not more than 3 mass %.