Method of printing laser mark and method of producing laser-marked silicon wafer

A method of producing a laser-marked silicon wafer, comprising:

• printing a laser mark having a plurality of dots on a silicon wafer that is obtained by slicing a single crystal silicon ingot grown by a predetermined method and is subjected to beveling;
• performing etching on at least a laser-mark printed region of the silicon wafer;
• and
• performing polishing on both surfaces of the silicon wafer having been subjected to the etching, wherein
• each of the plurality of dots is formed by using a laser light having a wavelength in an ultraviolet region,
• each of the plurality of dots is formed by performing an irradiation with the laser light a plurality of times,
• a number of pulses in each of the plurality of times of the irradiation with the laser light is 15,000 or more per second, and
• an amount removed by etching is 0.5 μm or more and 1.5 μm or less per side.