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US 12,082,378 B2Granted
Thermally conductive shock absorbers for electronic devices
AssigneeIntel Corporation
InventorsAleksander Magi, Jeff Ku, Juha Paavola, Prakash Kurma Raju
Life of this patent
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Abstract
Thermally conductive shock absorbers for electronic devices are disclosed. An electronic device includes a housing and a hardware component positioned inside the housing. A thermally conductive shock absorber is located between an inner surface of the housing and the hardware component. The thermally conductive shock absorber including an impact absorbing material and a thermal conductive material being in contact with at least a portion of the impact absorbing material.
Claims20
An electronic device comprising:
- a housing;
- a hardware component positioned inside the housing;
- a thermally conductive shock absorber located between an inner surface of the housing and the hardware component, the thermally conductive shock absorber including:
- an impact absorbing body, the impact absorbing body having an arcuate surface and a planar surface to define a cavity;
- and
- a thermal conductive material in contact with at least a portion of the arcuate surface of the impact absorbing body.
3 more elements
An electronic device comprising:
- a chassis;
- a processor;
- a printed circuit board;
- a heat sink;
- a plurality of shock absorbing bodies spaced apart and located between the heat sink and the chassis, the plurality of shock absorbing bodies respectively including an arcuate portion and a planar portion, the arcuate portions of a first set of the shock absorbing bodies in a first orientation and the arcuate portions of a second set of the shock absorbing bodies in a second orientation opposite the first orientation, the arcuate portions of the first set of the shock absorbing bodies and the arcuate portions of the second set of the shock absorbing bodies positioned in an alternating relationship;
- and
- a thermal conductive material having a first surface to at least partially engage the heat sink and a second surface to at least partially engage the chassis, the thermal conductive material to transfer heat from the heat sink to the chassis, the thermal conductive material to at least partially wrap around respective ones of the arcuate portions of the first set of the shock absorbing bodies and respective ones of the arcuate portion of the second set of shock absorbing bodies.
4 more elements
An electronic device comprising:
- means for processing instructions;
- means for housing the means for processing instructions;
- means for spreading heat from the means for processing instructions;
- means for absorbing shock from an impact;
- and
- means for transferring heat, the means for transferring heat including a planar and an arcuate surface that fully enclose the means for absorbing shock, the means for transferring heat and the means for absorbing shock between the means for spreading heat and the means for housing.
3 more elements
Dependencies are inferred from the claim text.