Apparatus, system, and method of providing underfill on a circuit board
AssigneeJabil Inc.
InventorsMark Tudman, Rayce Loftin
Life of this patent
Estimating the term…
Abstract
An apparatus, system and method for dispensing underfill to components on a printed circuit board. The apparatus, system and method may include an underfill chamber having an input through which the printed circuit board is received; at least one dispensing robot capable of dispensing the underfill to the components; a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber; and an overhead heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.
Claims18
An apparatus for dispensing underfill to components on a printed circuit board, comprising:
- an underfill chamber having an input through which the printed circuit board is received, wherein the underfill chamber is other than a vacuum chamber;
- at least two dispensing robots capable of dispensing the underfill to the components on the received printed circuit board;
- a lower heater suitable to substantially evenly heat at least half of or the entirety of an underside of the printed circuit board once the printed circuit board is within the underfill chamber;
- and
- an overhead heater comprising an inductive plate or infrared heater capable of heating up to half of a topside of the printed circuit board once the printed circuit board is within the underfill chamber.
Dependencies are inferred from the claim text.