Printed circuit board configuration blocks and edge projections

A printed circuit board, comprising:

• a core material;
• and
• a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block, wherein:
• the board configuration block is positioned within a region on the printed circuit board;
• the board configuration block comprises a signal chain block diagram;
• the signal chain block diagram comprises a diagram input reference trace, a diagram output reference trace, and a diagram intermediate reference trace between the diagram input reference trace and the diagram output reference trace in the signal chain block diagram;
• the plurality of metal traces further comprise a board reference indicator trace positioned outside the region on the printed circuit board;
• and
• the diagram intermediate reference trace in the region corresponds to the board reference indicator trace outside the region.

A printed circuit board, comprising:

• a core material;
• a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block;
• and
• a solder mask, the solder mask comprising a first region comprising pigment and a second region free from the pigment, wherein the board configuration block is positioned within the second region.

A printed circuit board, comprising:

• a core material;
• a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces and a board configuration block;
• and
• a solder mask, the solder mask comprising a first region comprising a first pigment and a second region comprising a second pigment, wherein the board configuration block is positioned within the second region.

A printed circuit board, comprising:

• a core material;
• and
• a metal layer comprising a plurality of metal traces on the core material, the plurality of metal traces comprising component interconnect traces, a board reference indicator trace, and a board configuration block, wherein:
• the board configuration block comprises a plan component trace and a plan reference trace within a region on the printed circuit board;
• the board reference indicator trace is positioned outside the region on the printed circuit board;
• and
• the plan reference trace in the region corresponds to the board reference indicator trace outside the region.