Packaged bulk acoustic wave resonator on acoustic wave device
AssigneeSkyworks Solutions, Inc.
InventorsKeiichi Maki, Hironori Fukuhara, Rei Goto
Life of this patent
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Abstract
A packaged acoustic wave filter component can include an acoustic wave device including a first piezoelectric layer and an interdigital transducer electrode on the first piezoelectric layer. A support layer may be included over the acoustic wave device, and the packaged hybrid filter component can also include a bulk acoustic wave resonator over the support layer. A cap layer may extend over and encapsulate the bulk acoustic wave resonator. One or more external vias may extend through the support layer and the underlying layers of the acoustic wave device to provide electrical communication with the packaged bulk acoustic wave generator.
Claims20
A packaged hybrid filter component comprising:
- an acoustic wave device including a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer;
- a support layer located over the interdigital transducer electrode;
- a bulk acoustic wave resonator supported by the support layer, the bulk acoustic wave resonator being included in an acoustic wave filter arranged to filter a radio frequency signal;
- a cap layer encapsulating the bulk acoustic wave resonator;
- and
- an external via in electrical communication with the bulk acoustic wave resonator, the external via extending through the support layer and the piezoelectric layer.
A packaged hybrid filter component comprising:
- a surface acoustic wave device including a piezoelectric layer and an interdigital transducer electrode on the piezoelectric layer;
- an additional layer located over the interdigital transducer electrode, the additional layer configured such that a surface acoustic wave of the surface acoustic wave device propagates along the additional layer;
- a bulk acoustic wave resonator supported by the additional layer, the bulk acoustic wave resonator being included in an acoustic wave filter arranged to filter a radio frequency signal;
- a cap layer encapsulating the bulk acoustic wave resonator;
- and
- an external via in electrical communication with the bulk acoustic wave resonator, the external via extending through the support layer and the piezoelectric layer.
Dependencies are inferred from the claim text.