Energy-saving heat treatment device for metal substrate in corrosive gas

An energy-saving heat treatment device for a metal substrate in a corrosive gas, comprising:

• a process chamber;
• a radiation field, arranged in a process space to provide a heat source for the process space;
• a process frame, arranged inside the process space to accommodate at least one substrate to carry out a rapid heat treatment process, an upper surface of an outer edge of the substrate being covered on the process frame;
• and
• a cover, covering a top of the process frame to isolate a space above the substrate from the process chamber;
• wherein the process frame, the substrate and the cover form a small process volume, and the small process volume reduces an amount of introduction and/or overflow of a process gas exchanged with the process chamber to a limit value;
• the cover is configured as:
• 1) being located inside the radiation field and remains stationary;
• or
• 2) being located on the process frame and forming an integral structure with the process frame;
• an outer edge of a lower surface of the substrate is covered by two methods:
• mode I):
• the process frame covers the outer edge of the lower surface of the substrate;
• or
• mode II) the substrate is in contact with a bottom surface of the radiation field so that the bottom surface of the radiation field covers a bottom surface of the substrate;
• the cover is located between two outer edges of the substrate, a covering area of the cover is within a range of 1 to 50 mm, and the cover is provided with a photoelectrically inert material;
• a bottom plate is arranged under the substrate in two forms:
• form a):
• the bottom plate supports the substrate and is located at a bottom end of the process frame and forms an integral structure with the process frame;
• and
• form b):
• the bottom plate supports the substrate and is installed on the bottom surface of the radiation field;
• and
• a sealing member for sealing an upper surface and/or a lower surface of the outer edge of the substrate is arranged in the outer edge of the substrate.