Method to form an inductive component
AssigneeCyntec Co., Ltd.
InventorsPei-I Wei, Cheng-Hao Chang, Shing Tak Li
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Abstract
A method to form an inductor, the method comprising: forming a metal structure by removing unwanted portions of the metal plate to form a first electrode, a second electrode, and a bare conductor wire between the first electrode and the second electrode, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire; and forming a magnetic body to encapsulate the bare conductor wire, and a least one portion of the first electrode and a least one portion of the second electrode.
Claims20
A method to form an inductive component, said method comprising:
- providing a metal plate;
- forming a metal structure by removing unwanted portions of the metal plate, said metal structure comprising a bare conductor wire, a first electrode and a second electrode, wherein the first electrode and the second electrode are integrally formed with the bare conductor wire, wherein a first thickness of the first electrode is greater than a thickness of the bare conductor wire, and a second thickness of the second electrode is greater than said thickness of the bare conductor wire, wherein a contiguous metal path is formed from a first lateral surface of the first electrode to a second lateral surface of the second electrode via the bare conductor wire;
- and
- forming a magnetic body to encapsulate the bare conductor wire, and at least one portion of the first electrode and at least one portion of the second electrode, wherein the first lateral surface of the first electrode and the second lateral surface of the second electrode are embedded inside the magnetic body.
Dependencies are inferred from the claim text.