Hot-melt adhesive and method for producing bonded article
AssigneeCanon Kabushiki Kaisha
InventorsKentaro Yamawaki, Yuhei Terui, Tsutomu Shimano
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Abstract
A hot-melt adhesive comprising a thermoplastic resin and a first crystalline material, wherein when in differential scanning calorimetric measurement of the hot-melt adhesive, Tc (° C.) is a peak temperature of the highest peak of exothermic peaks observed in a temperature reduction process at 10° C./min following heating to 150° C. and Tm (° C.) is a peak temperature of the highest peak of endothermic peaks observed in a temperature increasing process at 10° C./min following the temperature reduction process, Tm−Tc is 20.0 to 70.0° C., and a tetrahydrofuran-soluble matter of the hot-melt adhesive has a weight-average molecular weight Mw, as measured by gel permeation chromatography, of 100,000 to 400,000.
Claims8
A hot-melt adhesive, comprising:
- a thermoplastic resin;
- and
- a first crystalline material, wherein
- Tc is 20 to 60° C., Tm is 50 to 110° C. and Tm−Tc is 20.0 to 70.0° C.
- when in differential scanning calorimetric measurement of the hot-melt adhesive, Tc (° C.) is a peak temperature of the highest peak of exothermic peaks observed in a temperature reduction process at 10° C./min following heating to 150° C. and Tm (° C.) is a peak temperature of the highest peak of endothermic peaks observed in a temperature increasing process at 10° C./min following the temperature reduction process, and
- a tetrahydrofuran-soluble matter of the hot-melt adhesive has a weight-average molecular weight Mw of 100,000 to 400,000 as measured by gel permeation chromatography.
Dependencies are inferred from the claim text.