Topology optimized high interface packing structures

An article, comprising:

• a laminate material on a surface of a substrate having a lattice structure comprising a plurality of interconnected struts forming polyhedrons in a series that extends in three dimensions, the plurality of interconnected struts being arranged so that the laminate material has a void volume of at least 40%, and the laminate material comprising a plurality of alternating first layers and second layers and having an interface density of at least 2.0 interfaces/micrometer (μm),
• wherein:
• the substrate is a graded workpiece have a density gradient along a planar direction of the substrate due to an increase in thickness of the interconnecting struts along the planar direction of the substrate;
• the laminate material is a metal nanolaminate material;
• the first layers and the second layers differ in at least one of grain size, defect density, grain orientation, presence of intermetallic compositions, presence of amorphous metallic glass content, or a combination thereof;
• the first layers comprise a first metal or a first metal alloy having an average grain size ranging from about 1 nm to 1,000 nm based on a grain size measurement in micrographs;
• the second layers comprise a second metal or a second metal alloy having an average grain size ranging from about 1,000 nm to 5,000 nm based on a grain size measurement in micrographs;
• and
• the interface density is defined by the following formula:
• (L−1)/T,
• wherein:
• L is a number of layers;
• and
• T is a total thickness of the layers.