Energy augmentation structures in adhesive bonding compositions

An encapsulated semiconductor component, comprising a semiconductor assembly having thereon a covering of a cured adhesive composition, wherein the cured adhesive composition is formed by curing a curable adhesive composition comprising an organic vehicle comprising at least one polymerizable monomer;

• at least one photo-initiator responsive to a selected wavelength of light;
• and at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure.

An integrated circuit assembly comprising a plurality of electrically connected material layers, wherein the plurality of electrically connected material layers are held together by a cured adhesive composition obtained by curing a curable adhesive composition comprising an organic vehicle comprising at least one polymerizable monomer;

• at least one photo-initiator responsive to a selected wavelength of light;
• and at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• and wherein the integrated circuit has no external conductive connections between layers.

An encapsulated semiconductor component, comprising a semiconductor assembly having a substrate containing an insertion molded portion, wherein the insertion molded portion comprises a molding resin and has at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector on a surface thereof, wherein:

• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein the substrate has formed thereon at least one semiconductor component, and wherein the semiconductor component has thereon a covering of a cured adhesive composition, wherein the cured adhesive composition is formed by curing a curable adhesive composition comprising an organic vehicle comprising at least one polymerizable monomer;
• and at least one photo-initiator responsive to a selected wavelength of light.

A wafer to wafer bonded assembly, comprising a plurality of semiconductor wafers bonded together by a cured adhesive composition obtained by curing of a curable adhesive composition, wherein the curable adhesive composition comprises an organic vehicle comprising at least one polymerizable monomer;

• at least one photo-initiator responsive to a selected wavelength of light;
• and at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein (1) the viscosity of said organic vehicle is suitable for dispensing through an automated dispenser onto a selected substrate, (2) the viscosity of said organic vehicle is suitable for printing onto a selected substrate through a mask, or (3) wherein said adhesive is photo-patternable.

An electronic component, comprising:

• a substrate and one or more electronic elements, wherein the electronic component contains a cured adhesive formed from a curable adhesive composition,
• wherein the curable adhesive composition comprises:
• an organic vehicle comprising at least one polymerizable monomer,
• at least one photo-initiator responsive to a selected wavelength of light;
• and
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein the electronic component is a semiconductor component.

An electronic component, comprising:

• a substrate and one or more electronic elements, wherein the electronic component contains a cured adhesive formed from a curable adhesive composition,
• wherein the curable adhesive composition comprises:
• an organic vehicle comprising at least one polymerizable monomer,
• at least one photo-initiator responsive to a selected wavelength of light;
• and
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein the cured adhesive is an electrically conductive adhesive;
• wherein:
• (i) the electronic component is at least one member selected from the group consisting of:
• a semiconductor component, wherein the semiconductor component contains a wafer bonding connection and the wafer bonding is provided by the cured adhesive;
• a semiconductor component, wherein the semiconductor component contains a die to wafer connection and the die to wafer bonding is provided by the cured adhesive;
• a semiconductor component, wherein the semiconductor component contains a die to die connection and the die to die bonding is provided by the cured adhesive;
• a semiconductor component, wherein the semiconductor component contains a package on package assembly and package on package assembly is bonded with the cured adhesive;
• a semiconductor component, wherein the semiconductor component is a front end semiconductor and the cured adhesive is present as a pattern gate structure;
• a multichip module having a die on KOVAR substrate;
• a multichip module, and the cured adhesive is present as a lid sealer on the multichip module;
• an integrated circuit device, wherein the integrated circuit device is an integrated circuit wafer stack;
• an integrated circuit device, wherein the integrated circuit device is a flip chip;
• and
• a high density circuit;
• or
• (ii) the electronic component further comprises a micro-ball-grid-array encapsulated by the cured adhesive;
• or
• (iii) the electrically conductive adhesive comprises an electrically conductive filler which is carbon;
• or
• (iv) the curable adhesive composition further comprises a dielectric material;
• or
• (v) the electrically conductive adhesive comprises an electrically conductive filler that is an organic filler comprising anisotropic conductive polymer spheres;
• or
• (vi) the at least one energy converter comprises anisotropic conductive UV emitting polymer spheres;
• or
• (vii) the at least one photo-initiator and the at least one energy converter are chemically tethered to one another;
• or
• (viii) the cured adhesive is in the form of a film that is partially cured;
• or
• (ix) the cured adhesive is an isotropically conductive adhesive.

An electronic component, comprising:

• a substrate and one or more electronic elements, wherein the electronic component contains a cured adhesive formed from a curable adhesive composition,
• wherein the curable adhesive composition comprises:
• an organic vehicle comprising at least one polymerizable monomer,
• at least one photo-initiator responsive to a selected wavelength of light;
• and
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein the adhesive is a thermally conductive adhesive;
• wherein:
• (i) the electronic component is at least one member selected from the group consisting of:
• a semiconductor component, wherein the semiconductor component contains a wafer bonding connection and the wafer bonding is provided by the cured adhesive;
• a semiconductor component, wherein the semiconductor component contains a die to wafer connection and the die to wafer bonding is provided by the cured adhesive;
• a semiconductor component, wherein the semiconductor component contains a die to die connection and the die to die bonding is provided by the cured adhesive;
• a semiconductor component, wherein the semiconductor component contains a package on package assembly and package on package assembly is bonded with the cured adhesive;
• a semiconductor component, wherein the semiconductor component is a front end semiconductor and the cured adhesive is present as a pattern gate structure;
• a multichip module having a die on KOVAR substrate;
• a multichip module, and the cured adhesive is present as a lid sealer on the multichip module;
• an integrated circuit device, wherein the integrated circuit device is an integrated circuit wafer stack;
• an integrated circuit device, wherein the integrated circuit device is a flip chip;
• and
• a high density circuit;
• or
• (ii) the thermally conductive adhesive is electrically insulating;
• or
• (iii) the cured adhesive is present in a form selected from the group consisting of glob-top structures, dam-and-fill structures, underfill structures, die-underfill structures, and lid sealing structures;
• or
• (iv) the electronic component further comprises a micro-ball-grid-array encapsulated by the cured adhesive;
• or
• (v) the electronic component comprises a flexible cirduit electrically connected with a semiconductor integrated circuit by tape automatic bonding (TAB) technique, wherein the TAB area is encapsulated by the cured adhesive;
• or
• (vi) the at least one photo-initiator and the at least one energy converter are chemically tethered to one another;
• or
• (vii) the cured adhesive is in the form of a film that is partially cured;
• or
• (viii) the curable adhesive composition further comprises a dielectric material.

An electronic component, comprising:

• a semiconductor device attached to a substrate,
• wherein the semiconductor device is attached to the substrate through a plurality of rigid protrusions attached to one side of the semiconductor device, which are configured to be in electrical contact with a plurality of electrical pads situated on the substrate;
• wherein the plurality of rigid protrusions are formed from a first curable resin or adhesive composition comprising:
• a first organic vehicle comprising at least one first polymerizable monomer;
• at least one first photo-initiator responsive to a first selected wavelength of light;
• and,
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• such that upon application of a first imparted radiation, the first curable resin or adhesive composition is cured to provide the rigid protrusions between the semiconductor device and the plurality of electrical pads on the substrate.

An optically transparent resin or adhesive composition comprising:

• an organic vehicle comprising at least one polymerizable monomer which, upon polymerization, forms an optically transparent resin or adhesive;
• at least one photo-initiator responsive to a selected wavelength of light;
• and,
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein the at least one energy converter contained therein is selected to emit said selected wavelength of light when exposed to an imparted radiation, wherein the at least one energy converter has a particle size below a desired wavelength of transmissivity transmitted through the cured optically transparent resin or adhesive.

An electrically conductive resin or adhesive composition comprising:

• an organic vehicle comprising at least one polymerizable monomer;
• at least one photo-initiator responsive to a selected wavelength of light;
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• wherein the at least one energy converter contained therein is selected to emit said selected wavelength of light when exposed to an imparted radiation,
• wherein the at least one energy converter comprises an isotropically or anisotropically conductive polymer particle, or the composition further comprises at least one electrically conductive additive, or both, and
• wherein (1) the viscosity of said organic vehicle is suitable for dispensing through an automated dispenser onto a selected substrate, (2) the viscosity of said organic vehicle is suitable for printing onto a selected substrate through a mask, or (3) wherein said adhesive is photo-patternable.

An anisotropic conductive polymer sphere comprising a polymeric core having at least a portion of an outer surface of the sphere coated with at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:

• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure.

An electrically conductive resin or adhesive composition comprising:

• an organic vehicle comprising at least one polymerizable monomer which, upon polymerization, forms an electrically conductive resin or adhesive;
• at least one photo-initiator responsive to a selected wavelength of light;
• and,
• at least one (i) energy emitter, (ii) energy augmentation structure, or (iii) energy collector, wherein:
• the at least one (i) energy emitter, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and an energy converter capable of receiving energy from an energy source, converting the energy and emitting therefrom an emitted light of a higher or lower energy than the received energy, and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted light is emitted with an intensity larger than if the energy converter were remote from the at least one energy augmentation structure, or if the energy augmentation structure were not present;
• the at least one (ii) energy augmentation structure, when present, is capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• the at least one (iii) energy collector, when present, comprises at least one energy augmentation structure capable of capturing one or more wavelengths of electromagnetic energy, and augmenting the one or more wavelengths of electromagnetic energy in at least one property;
• and at least one energy converter capable of receiving an applied electromagnetic energy, converting the applied electromagnetic energy and emitting therefrom an emitted electromagnetic energy shifted in wavelength or energy from the applied electromagnetic energy and the energy converter being disposed in a vicinity of the at least one energy augmentation structure such that the emitted electromagnetic energy is emitted with at least one augmented property compared to if the energy converter were remote from the at least one energy augmentation structure;
• such that the resin or adhesive composition formed exhibits electrical conductivity or semiconductivity without the presence of an electrically conductive additive.