Radio-frequency module and communication device

A radio-frequency module comprising:

• a module substrate;
• and
• a power amplification circuit on or in the module substrate,
• wherein the power amplification circuit comprises:
• a first amplification circuit element, a second amplification circuit element, a third amplification circuit element, and a fourth amplification circuit element,
• a transformer having a primary coil and a secondary coil,
• an output terminal to which a first end of the secondary coil is connected, and
• a first circuit component on a main surface of the module substrate,
• wherein an output terminal of the first amplification circuit element and an output terminal of the third amplification circuit element are connected to a first terminal of the primary coil,
• wherein an output terminal of the second amplification circuit element and an output terminal of the fourth amplification circuit element are connected to a second terminal of the primary coil,
• wherein a first capacitance element is connected at a first end to a first wiring line path and at a second end to a second wiring line path, the first wiring line path connecting the output terminal of the first amplification circuit element to the first terminal, and the second wiring line path connecting the output terminal of the second amplification circuit element to the second terminal,
• wherein one of the primary coil or the secondary coil comprises a first conductive layer on the module substrate,
• wherein the first conductive layer on the module substrate surrounds at least part of the first circuit component on the module substrate when the module substrate is viewed in a plan view,
• wherein the other one of the primary coil or the secondary coil comprises a second conductive layer that is in a different layer inside the module substrate than the first conductive layer,
• wherein the second conductive layer surrounds at least part of the first circuit component when the module substrate is viewed in the plan view, and
• wherein the first circuit component comprises the first capacitance element.