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US 12,074,587 B2Granted
Single substrate multiplexer
AssigneeRF360 Singapore Pte. Ltd.
InventorsFlorian Habel, Thomas Bauer, Peter Hagn, Thomas Dengler
Life of this patent
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Abstract
At least three acoustic filters circuits FC are arranged on a single chip CH. At least two of them are electrically connected already on the chip for multiplexing. This reduces space consumption and leads to smaller device size.
Claims11
A multiplexer, comprising:
- a monolithic stack comprising:
- a carrier substrate;
- a piezoelectric layer above the carrier substrate having a main surface;
- and
- at least one dielectric layer arranged between the piezoelectric layer and the carrier substrate;
- a metallization on top of the main surface comprising:
- an antenna terminal for connection with an antenna;
- three signal pads;
- a trap-rich layer (TRL) provided between the carrier substrate and the piezoelectric layer, wherein the trap-rich layer comprises a polycrystalline silicon layer;
- three surface acoustic wave (SAW) filter circuits connected in parallel between the antenna terminal and a respective signal pad, wherein each of the three SAW filter circuits comprises a corresponding series signal line and a number of SAW resonators connected in series with or parallel to the corresponding series signal line;
- and
- a package providing a cavity on top of the monolithic stack, wherein the three SAW filter circuits are enclosed in the cavity that is formed between the main surface of the piezoelectric layer and a lid and/or a cover.
9 more elements
Dependencies are inferred from the claim text.