Substrate dimension adapter
AssigneeUnity Semiconductor Corporation
InventorsYueh Sheng Ow, Mayeul Durand de Gevigney, Christophe Isnard
Life of this patent
Estimating the term…
Loading patent…
AssigneeUnity Semiconductor Corporation
InventorsYueh Sheng Ow, Mayeul Durand de Gevigney, Christophe Isnard
Estimating the term…
An adapter for retaining a wafer has a back side intended to be placed on, and to extend over, a first suction channel and a second suction channel disposed on a main face of a support. The adapter has a shallow recess disposed on the front side to receive the wafer, the shallow recess being shaped to the wafer size and having a flat base to contact a surface of the wafer. The adapter also includes a vacuum network extending through the adapter and comprising at least one through-passage connecting the adapter back side and the adapter front side, the through-passage opening out, on the front side, in the shallow recess. The through-passage intercepts, on the back side, the first suction channel of the support but not the second suction channel.
An adapter for retaining a substrate on a support of an equipment, the substrate having a substrate dimension not compatible with the support, the adapter having a front side to receive the substrate and a back side opposite the front side, the adapter back side being configured to be placed on, and to extend over, a main face of the support, the main face of the support comprising a first suction channel and a second suction channel, the adapter comprising:
Dependencies are inferred from the claim text.