Resist underlayer film-forming composition and method for forming resist pattern using the same
AssigneeNissan Chemical Corporation
InventorsShou Shimizu, Ryuta Mizuochi, Hiroyuki Wakayama, Yasunobu Someya
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AssigneeNissan Chemical Corporation
InventorsShou Shimizu, Ryuta Mizuochi, Hiroyuki Wakayama, Yasunobu Someya
Estimating the term…
A composition for forming a resist underlayer film enables the formation of a desired resist pattern; and a method for forming a resist pattern using this resist underlayer film forming composition. A resist underlayer film forming composition contains an organic solvent and a polymer that has a structure represented by formula (1) or (2) at an end of the polymer chain. (In formula (1) and formula (2), X represents a divalent organic group; A represents an aryl group having 6-40 carbon atoms; R1 represents a halogen atom, an alkyl group having 1-40 carbon atoms or an alkoxy group having 1-40 carbon atoms; each of R2 and R3 independently represents a hydrogen atom, an optionally substituted alkyl group having 1-10 carbon atoms, an aryl group having 6-40 carbon atoms or a halogen atom; each of n1 and n3 independently represents an integer of 1-12; and n2 represents an integer of 0-11.)
A resist underlayer film-forming composition, comprising an organic solvent and a polymer, wherein one or more terminal ends of the polymer are represented by the following formula (1) or (2):
A resist underlayer film-forming composition, comprising an organic solvent and a polymer,
Dependencies are inferred from the claim text.