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AssigneeAsmpt Singapore Pte. Ltd.
InventorsKa Shing Kwan, Ajit Shriman Gaunekar, Zhi Tao Wang
Estimating the term…
A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated includes a deformable portion and a contacting stem connected to the deformable portion. The deformable portion is configured to incorporate a sensor for detecting a degree of deformation of the deformable portion caused by application of the force in order to measure the force. In use, the contacting stem is positionable to contact the component or the component carrier so that the deformable portion is deformed when the force is applied to the component. One or more such devices may be included in a sintering or encapsulation apparatus for measuring the said force.
A device for measuring a force applied to a component when the component is being bonded to a component carrier, or when the component is being encapsulated, the device comprising:
A sintering or encapsulation apparatus comprising:
A method for measuring a force applied to a component when the component is being bonded to a component carrier by a sintering apparatus, or when the component is being encapsulated by an encapsulation apparatus, the method comprising:
Dependencies are inferred from the claim text.