US 12,071,702 B2 · Acidic aqueous composition for electrolytic copper plating

Abstract

The present invention relates to a composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising: one to three quinoline group and one or more polyethylene glycol group, wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group.

Claims2

Dependent claims

A composition comprising one or a mixture of two or more quinoline-polyethylene glycol containing compound, each quinoline-polyethylene glycol containing compound comprising:

one to three quinoline group and
one or more polyethylene glycol group,
wherein, in each said quinoline-polyethylene glycol containing compound, one to three of said one to three quinoline group is connected via one or more oxygen atom of said one or more polyethylene glycol group via carbon 6 or carbon 8 of said one to three quinoline group,
wherein the compound is selected from the group consisting of:

1 more element

Dependencies are inferred from the claim text.

Facts

Application

17/315,810Filed 10 May 2021 · division

Priority

EP 1618420015 Aug 2016

Published

US 2021/0262105 A126 Aug 2021

Granted

27 Aug 2024

Term ends

Not estimatedThe source records don’t support an estimate.

Classification10 codes

C25D 3/38
From solutions: of copper
C07C 215/20
The carbon skeleton being saturated: the carbon skeleton being saturated and containing rings
C07C 215/24
The carbon skeleton being unsaturated: and acyclic
C07D 215/20
With hetero atoms or with carbon atoms having three bonds to hetero atoms with at the most one bond to halogen, e.g. ester or nitrile radicals,…:…

Family

PCT/EP2017/070286Parent of this division · filed 10 Aug 2017

US 2021/0262105 A1Pre-grant publication · published 26 Aug 2021

Application16/323,582Parent of this division

US 11,035,051 B2Parent of this division

US 2019/0203369 A1Published application

US 12,071,702 B2This patent

From the US filing history. Foreign family members aren’t listed.

Acidic aqueous composition for electrolytic copper plating

Life of this patent

Acidic aqueous composition for electrolytic copper plating

Life of this patent

Abstract

Claims2