Curable resin composition, use thereof, and production method thereof
AssigneeDaicel-Evonik Ltd.
InventorsMitsuteru Mutsuda, Hirofumi Iguchi, Toshiaki Nakamura
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Abstract
[Object] The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal. [Solution] A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.
Claims12
A curable resin composition comprising:
- a polyamide-based resin (A) having an amino group;
- a blocked polyisocyanate (B);
- and
- an epoxy compound (C), wherein
- the polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower;
- a mass ratio of the polyamide-based resin (A1) to the polyamide-based resin (A2), in the form of the former/the latter, is from 60/40 to 40/60;
- a ratio of the isocyanate group of the blocked polyisocyanate (B) per 1 mol of the amino group of the polyamide-based resin (A) is from 1.5 to 5 mol;
- and
- a ratio of the epoxy group of the epoxy compound (C) per 1 mol of the amino group of the polyamide-based resin (A) is from 0.1 to 0.8 mol.
Dependencies are inferred from the claim text.