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US 12,068,739 B2Granted
Micro-transfer-printed acoustic wave filter device
AssigneeX-Celeprint Limited
InventorsChristopher Bower, Matthew Meitl, Ronald S. Cok
Life of this patent
Estimating the term…
Abstract
A compound acoustic wave filter device comprises a support substrate having an including two or more circuit connection pads. An acoustic wave filter includes a piezoelectric filter element and two or more electrodes. The acoustic wave filter is micro-transfer printed onto the support substrate. An electrical conductor electrically connects one or more of the circuit connection pads to one or more of the electrodes.
Claims22
A heterogeneous device, comprising:
- a first substrate comprising a first material;
- an active first circuit formed in or on the first substrate, the active first circuit comprising one or more first connection pads connected to the active first circuit for providing signals to the active first circuit or receiving signals from the active first circuit;
- a second substrate separate, distinct, and independent from the first substrate, the second substrate comprising a second material different from the first material, and the second substrate directly or indirectly micro-transfer printed on the first substrate;
- two or more electrodes or a second circuit formed in or on the second substrate, the two or more electrodes or second circuit comprising one or more second connection pads connected to the two or more electrodes or second circuit for providing signals to the electrodes or receiving signals from the two or more electrodes;
- and
- one or more electrical conductors electrically connecting one or more of the first connection pads to one or more of the second connection pads.
3 more elements
A method of making a heterogeneous device, comprising:
- providing a first substrate with an active first circuit formed in or on the first substrate, the first circuit comprising one or more first connection pads connected to the first circuit for providing signals to the first circuit or receiving signals from the first circuit;
- providing a second substrate separate, distinct, and independent from the first substrate, two or more electrodes or a second circuit formed in or on the second substrate, and two or more second connection pads connected to the two or more electrodes or second circuit for providing signals to or receiving signals from the two or more electrodes or second circuit;
- directly or indirectly micro-transfer printing the second substrate on the first substrate;
- and
- electrically connecting one or more of the first connection pads to one or more of the second connection pads.
2 more elements
Dependencies are inferred from the claim text.