Microscale plasma limiter integrated into thick film interconnect

A microscale package comprising:

• an integrated circuit;
• and
• a radio frequency transmission line including:
• a substrate including a surface;
• a first ground line disposed on the surface;
• a second ground line disposed on the surface;
• a signal line disposed on the surface between the first ground line and the second ground line and forming a coplanar waveguide with the first ground line and the second ground line;
• wherein the signal line, the first ground line, and the second ground line are substantially parallel in a first section of the radio frequency transmission line;
• the signal line and the first ground line defining a first gap in the first section;
• the signal line and the second ground line defining a second gap in the first section;
• wherein the first gap and the second gap are hermetically sealed by a hermetic seal and include a gas;
• and
• a plasma limiter disposed between the signal line and the first ground line in the first gap, the plasma limiter integrated into one or more of the signal line or the first ground line, the plasma limiter defining a spark-gap between the signal line and the first ground line;
• the radio frequency transmission line including a breakdown power threshold at which the gas disposed in the spark-gap is configured to form a plasma;
• wherein the plasma changes a characteristic impedance of the radio frequency transmission line;
• wherein each of the signal line, the first ground line, and the second ground line is coupled to the integrated circuit;
• wherein the change in the characteristic impedance of the radio frequency transmission line limits a power to the integrated circuit;
• wherein each of the signal line, the first ground line, and the second ground line is further configured to couple to a carrier substrate;
• wherein the plasma limiter comprises a spiral-shaped resonator.