Method of manufacturing electronic component

A method of manufacturing an electronic component that is operatively associated with a rotary polishing machine, the electronic component including at least a multilayer body and an insulating layer that covers a side surface of the multilayer body, the multilayer body including a plurality of dielectric layers and a plurality of internal electrodes that are alternately stacked on one another, and the method comprising:

• preparing an unfired multilayer body that is to be formed as the multilayer body after firing, the unfired multilayer body including:
• a first main surface and a second main surface that are opposite to each other in a stacking direction;
• a first side surface and a second side surface that are opposite to each other in a width direction orthogonal to the stacking direction;
• and
• a first end surface and a second end surface that are opposite to each other in a length direction orthogonal to the stacking direction and the width direction;
• bonding one side surface of the first side surface and the second side surface of each unfired multilayer body to an adhesive sheet such that a plurality of the unfired multilayer bodies are disposed on the adhesive sheet in at least one row;
• polishing the other side surface of the first side surface and the second side surface of each of the plurality of unfired multilayer bodies provided in the at least one row by rotating a polishing surface of the rotary polishing machine in a state where the polishing surface is in contact with the other side surface of each of the plurality of unfired multilayer bodies;
• and
• forming a first insulating layer on the polished other side surface;
• wherein
• in the polishing the other side surface, at least one of the rotary polishing machine and the adhesive sheet is moved relative to the other of the rotary polishing machine and the adhesive sheet to form a polish groove in the length direction;
• and
• the rotary polishing machine has a cylindrical shape and includes an outer circumferential surface that defines and functions as the polishing surface.