Radiation sensor with an integrated mechanical optical modulator and related manufacturing process

A device, comprising:

• a radiation sensor comprising:
• a first body;
• a second body;
• a main cavity between the first body and the second body;
• a detection assembly coupled to a chopper assembly between the first body and the second body, the detection assembly and the chopper assembly delimiting the main cavity, wherein the chopper assembly comprises:
• a suspended movable structure in the main cavity;
• and
• an actuation structure including a first component embedded in the suspended movable structure and configured to be electrically controlled to cause a change of position of the suspended movable structure,
• wherein the detection assembly comprises a member extending across a detection cavity between the detection cavity and the main cavity and facing the main cavity and including a plurality of detection devices embedded in the member, and
• wherein the suspended movable structure includes a first shield of conductive material, the first shield being configured to shield the plurality of detection devices from radiation, the shielding of the plurality of detection devices being a function of a position of the suspended movable structure,
• a package comprising a packaging structure that is optically opaque and delimits an accommodation cavity overlaid by an opening;
• and
• a lens covering the opening,
• wherein the radiation sensor is arranged inside the accommodation cavity, the lens being positioned and configured to focus the radiation to the radiation sensor.

A process of manufacturing a radiation sensor comprising:

• forming a first body and a second body;
• forming a main cavity between the first body and the second body;
• a detection cavity between the main cavity and the second body;
• forming a detection assembly and a chopper assembly between the first body and the second body;
• and
• mechanically coupling the detection assembly and the chopper assembly so that the detection assembly and the chopper assembly delimit the main cavity,
• wherein forming the chopper assembly includes:
• forming a suspended movable structure in the main cavity;
• and
• forming an actuation structure including a first component embedded in the suspended movable structure and that is electrically controllable to cause a change of position of the suspended movable structure,
• wherein forming the detection assembly comprises forming a member extending across the detection cavity between the detection cavity and the main cavity and including a plurality of detection devices embedded in the member and facing the main cavity, and wherein forming the suspended movable structure includes forming a first shield of conductive material configured to shield the plurality of detection devices from radiation, the shielding of the plurality of detection devices being a function of the position of the suspended movable structure.