Adhesive tape
AssigneeDIC Corporation
InventorDaisuke Watanabe
Life of this patent
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Abstract
An object of the present invention is to provide an adhesive tape that can be removed from an adherend more easily and more rapidly. The adhesive tape of the present invention includes a base material layer, and adhesive layers on both sides of the base material layer, the base material layer has a thickness of 10 to 100 μm, a breaking strength of 20 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and an adhesive composition forming the adhesive layers contains 1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 μm with respect to 100% by mass of the adhesive composition.
Claims13
An adhesive tape comprising:
- a base material layer;
- and
- adhesive layers formed of an adhesive composition provided on both sides of the base material layer,
- wherein the base material layer has a thickness of 10 to 100 μm, a breaking strength of 30 to 90 MPa, a breaking elongation of 400% to 1,500%, and a 100% modulus of 1 to 5 MPa, and
- the adhesive composition comprises:
- an adhesive resin;
- and
- 1% to 40% by mass of filler particles having an average particle diameter of 0.1 to 40 μm with respect to 100% by mass of the adhesive composition.
Dependencies are inferred from the claim text.