Method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine
AssigneeIntegrated Dynamics Engineering GmbH
InventorAndreas Birkner
Life of this patent
Estimating the term…
Abstract
A method for processing substrates, in particular wafers, masks or flat panel displays, with a semi-conductor industry machine, wherein a computer-supported process is used to determine the presence and/or position and/or orientation of the substrate. Further, a system designed to execute the method. The computer-supported process includes an artificial neural network.
Claims13
A method for processing substrates including wafers, masks, and flat panel displays, with a semiconductor industry machine, the processing including a gripper or an end effector configured to pick up and transport of the substrates between two or more processing stations, the method comprising:
- obtaining, with at least one acquisition unit comprising an image recording device, at least one image of a location in the semiconductor industry machine;
- generating, with a processing unit executing an artificial neural network, an information data set comprising information as to whether a substrate is present in the location in the semiconductor industry machine, the information data set being generated by analyzing the at least one image with an the artificial neural network executed by the processing unit, wherein the information data set comprises information on a presence of the substrate including:
- in a slot;
- on a tray;
- on a robot;
- on an end effector;
- or on a processing station in the machine;
- and
- generating, with the processing unit executing the artificial neural network, a control command by evaluating the information data set, the control command comprising an instruction to move a system unit of the semiconductor industry machine,
- wherein the artificial neural network executed by the processing unit detects incorrect positions of the substrate, including an incorrect position selected from the group consisting of:
- whether the substrate is located over several layers of a tray, whether the incorrect position concerns at least two substrates located directly on top of each other, whether the incorrect position concerns a deviation from a specified target position of a substrate, and whether the incorrect position concerns a substrate not correctly positioned on all provided support points of a tray, and
- wherein the instruction to move the system unit is selected from the group consisting of a robot, a movable element of a robot, a robot arm, an end effector of a robot arm, and a positioning unit;
- and
- transporting, based on the instruction, the substrate to a designated location.
Dependencies are inferred from the claim text.