Particle removal method in semiconductor fabrication process
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Ming Tsao, Po-Cheng Chen, Deng-An Wang
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChih-Ming Tsao, Po-Cheng Chen, Deng-An Wang
Estimating the term…
A system for processing a semiconductor wafer is provided. The system includes a processing tool. The system also includes gas handling housing having a gas inlet and a gas outlet. The system further includes an exhaust conduit fluidly communicating with the processing tool and the gas inlet of the gas handling housing. In addition, the system includes at least one first filtering assembly and at least one second filtering assembly. The first filtering assembly and the second filtering assembly are positioned in the gas handling housing and arranged in a series along a flowing path that extends from the gas inlet to the gas outlet of the gas handling housing. Each of the first filtering assembly and the second filtering assembly comprises a plurality of wire meshes stacked on top of another.
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Dependencies are inferred from the claim text.