Watch assembly method and wearable device
AssigneeBeijing Xiaomi Mobile Software Co., Ltd.
InventorXuefeng Wang
Life of this patent
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Abstract
A watch assembly method includes: processing a first bonding surface on a first connecting member, bonding a first laser adhesive layer on the first bonding surface and activating the first laser adhesive layer; processing a second bonding surface on a second connecting member, bonding a second laser adhesive layer on the second bonding surface and activating the second laser adhesive layer; fixing the second connecting member with the first connecting member preliminarily in such a manner that the first laser adhesive layer and the second laser adhesive layer face each other, and pressing the first connecting member and the second connecting member against each other until the first laser adhesive layer and the second laser adhesive layer are completely bonded and infiltrated.
Claims11
A watch assembly method, comprising:
- processing a first bonding surface on a first connecting member, bonding a first laser adhesive layer on the first bonding surface and activating the first laser adhesive layer;
- processing a second bonding surface on a second connecting member, bonding a second laser adhesive layer on the second bonding surface and activating the second laser adhesive layer;
- fixing the second connecting member with the first connecting member preliminarily in such a manner that the first laser adhesive layer and the second laser adhesive layer face each other, and pressing the first connecting member and the second connecting member against each other until the first laser adhesive layer and the second laser adhesive layer are completely bonded and infiltrated, wherein each of the first bonding surface and the second bonding surface is processed by a laser engraving process, a surface energy of the first bonding surface is greater than 34 A, a surface energy of the second bonding surface is greater than 36 A, and each of a roughness of the first bonding surface and a roughness of the second bonding surface is greater than 0.6 μm.
Dependencies are inferred from the claim text.