High power surface mount filter
AssigneeKYOCERA AVX Components Corporation
InventorsKwang Choi, Marianne Berolini, Michael W. Kirk, Hector Fuentes, Jonathan C. Herr, Bryan R. Seither
Life of this patent
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Abstract
A filter assembly is disclosed that includes a monolithic filter having a surface and a heat sink coupled to the surface of the monolithic filter. The heat sink includes a layer of thermally conductive material that can have a thickness greater than about 0.02 mm. The heat sink may provide electrical shielding for the monolithic filter. In some embodiments, the filter assembly may include an organic dielectric material, such as liquid crystalline polymer or polyphenyl ether. In some embodiments, the filter assembly may include an additional monolithic filter.
Claims18
A multi-layer filter assembly comprising:
- a multi-layer filter having a surface;
- and
- a heat sink coupled to the surface of the multi-layer filter, the heat sink comprising a layer of thermally conductive material that has a thickness that is greater than about 0.02 mm,
- wherein the filter assembly has an area power capacity greater than about 0.05 W/mm2 at about 300 MHz,
- wherein the filter assembly has a first insertion loss greater than −15 dB for frequencies within a frequency range of the filter assembly,
- wherein the filter assembly has a second insertion loss less than −15 dB for frequencies outside of the frequency range of the filter assembly,
- wherein the multi-layer filter includes an inductor comprising a stitched metal layer building block,
- wherein the stitched metal layer building block comprises a first inductor section having a first connection point and a second connection point and a second inductor section having a first connection point and a second connection point,
- wherein the first connection point of the first inductor section is stitched to the first connection point of the second inductor section using a first via, and
- wherein the second connection point of the first inductor section is stitched to the second connection point of the second inductor section using a second via.
A multi-layer organic filter assembly comprising:
- a multi-layer organic filter having a first surface and a second surface opposite the first surface along a Z-direction;
- a heat sink coupled to the first surface of the multi-layer organic filter, the heat sink comprising a layer of thermally conductive material;
- and
- at least one connection point defined on the second surface of the multi-layer organic filter such that the at least one connection point is defined on the multi-layer organic filter opposite the heat sink,
- wherein the at least one connection point is configured to be coupled to a mounting surface of a printed circuit board,
- wherein the filter assembly has a first insertion loss greater than −15 dB for frequencies within a frequency range of the filter assembly, and
- wherein the filter assembly has a second insertion loss less than −15 dB for frequencies outside of the frequency range of the filter assembly.
A multi-layer filter assembly comprising:
- a multi-layer filter having a first surface and a second surface opposite the first surface;
- and
- a heat sink coupled to the surface of the multi-layer filter, the heat sink comprising a layer of thermally conductive material;
- wherein:
- the filter assembly exhibits a first insertion loss at about 25° C. and at a first frequency;
- the filter assembly exhibits a second insertion loss at a second temperature and at about the first frequency;
- a temperature difference between the first temperature and the second temperature is about 30° C. or greater;
- a difference between the second insertion loss and the first insertion loss is about 5 dB or less;
- the first insertion loss is greater than −15 dB for frequencies within a frequency range of the filter assembly;
- the second insertion loss is less than −15 dB for frequencies outside of the frequency range of the filter assembly;
- the filter assembly has an area power capacity greater than about 0.05 W/mm2 at about 300 MHz;
- at least one connection point is defined on the second surface of the multi-layer filter;
- and
- the at least one connection point is configured to be coupled to a mounting surface of a printed circuit board such that the multi-layer filter is disposed between the heat sink and the mounting surface.
Dependencies are inferred from the claim text.