Method for producing a metal-ceramic substrate, and metal-ceramic substrate produced using such a method

A method of manufacturing a metal-ceramic substrate (1) which, in the manufactured state, has a ceramic layer (11) and a metal layer (12) extending along a main extension plane (MPE) and being arranged one above the other along a stacking direction (S) extending perpendicularly to the main extension plane (MPE), comprising:

• providing the metal layer (12) with a thickness between 200 μm and 1000 μm and the ceramic layer (11) and
• bonding the metal layer (12) to the ceramic layer (11) region by region to form a first region (B1), which has a materially bonded connection between the metal layer (12) and the ceramic layer (11), and a second region (B2), in which the metal layer (12) and the ceramic layer (11) are arranged one above the other without a materially bonded connection, viewed in the stacking direction (S), characterized in that the second region (B2) is provided at least in regions as a connecting surface and/or as a terminal, characterized in that in that the second region (32) is obtained during a bonding process in that the metal layer (12) is only partially oxidized on an upper and/or lower side before the bonding process is carried out, regions remaining free from oxidation which is required in the bonding process for the formation of a eutectic and thus for the bond between the metal layer and the ceramic layer, and in that the metal layer (12) is structured after the bonding process in order to form conductor paths or connection.