Devices and methods related to metallization of ceramic substrates for shielding applications

A ceramic assembly comprising a plurality of layers, the assembly including a boundary between a first region and a second region, the assembly further including a selected layer having a plurality of conductive features implemented on the selected layer along the boundary, each conductive feature extending into the first region and the second region such that the first region and the second region are separable through every layer of the ceramic assembly to form respective side walls, each side wall including exposed portions of the conductive features capable of forming electrical connection with a conductive shielding layer, the conductive shielding layer configured to extend along the respective side walls to make contact with every layer of the plurality of layers, the each conductive feature having a shape at or near the boundary that increases a likelihood of separation along the boundary, at least one conductive feature including two shaped vias implemented along the boundary such that a first shaped via is in the first region and a second shaped via is in the second region, the first shaped via and the second shaped via being in contact at least in part along the boundary, the first shaped via and the second shaped via including a notch along the boundary.