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AssigneeHuawei Technologies Co., Ltd.
InventorsChaojun Deng, Fei Ma, Wei Fang, Zhiwen Yang, Chungang Li, Shun Hao
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A circuit board assembly is applied to the field of electronic communications technologies to resolve a prior-art heat dissipation problem of a circuit board. The circuit board assembly combines, on a second circuit board, low-speed signals transmitted between a plurality of I/O modules and an IC chip, and then transmits the combined low-speed signals to the IC chip by using a low-speed cable. A low-speed signal sent by the IC chip to the plurality of I/O modules is extended to a plurality of low-speed signals on the second circuit board, and then the plurality of low-speed signals are separately sent to the plurality of I/O modules. This may be applied to a scenario in which a relatively large quantity of electronic components need to be disposed on a circuit board.
A circuit board assembly, comprising a first circuit board, a second circuit board, one or more low-speed cables, a plurality of high-speed cables, an integrated circuit (IC) chip, a chip heat sink, a plurality of high-speed connectors, a plurality of input/output (I/O) modules, and a monitoring module, wherein the IC chip, and the high-speed connectors are installed on the first circuit board, the plurality of I/O modules and the monitoring module are installed on the second circuit board, the IC chip is connected to the monitoring module by using the low-speed cable, and the monitoring module is connected to the plurality of I/O modules by using an intra-board cable;
An electronic device, comprising a housing, a heat dissipation apparatus, and a plurality of circuit board assemblies, wherein the circuit board assemblies are installed inside the housing, and the heat dissipation apparatus is configured to dissipate heat for the circuit board assemblies;
Dependencies are inferred from the claim text.