Forming integrated inductors and transformers with embedded magnetic cores
AssigneeTexas Instruments Incorporated
InventorAnindya Poddar
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Abstract
In accordance with an embodiment of the application a method of forming an integrated magnetic device is described. A prepreg or core is mounted on a carrier. A winding layer is plated and patterned on the prepreg or core. Vias are plated. The silicon is placed on a die attach pad, ensuring sufficient clearance of die to vias and d/a char. The assembly is laminated and grinded to expose the vias. A 2nd layer of vias is provided by sputtering or plating followed by laminating assembly; and grinding assembly to expose vias. The windings are plated and patterned. A solder mask (SMSK) is applied and assembly finished.
Claims13
A semiconductor package comprising:
- a substrate;
- a first winding layer on the substrate;
- an attach layer on the first winding layer;
- a carrier on the attach layer;
- a magnetic core on the carrier, wherein the magnetic core is disposed over the first winding layer with the carrier and the attach layer between the first winding layer and the magnetic core;
- a first via physically contacting the first winding layer;
- a first film covering portions of the first via, the magnetic core, the first winding layer, and the substrate;
- a second via on the first via, wherein a first footprint of the first via is greater than a second footprint of the second via, and wherein the first footprint surrounds the second footprint;
- a second film covering portions of the second via and the magnetic core;
- and
- a second winding layer on the second film and connected to the second via.
Dependencies are inferred from the claim text.