Inspection method, inspection system, and semiconductor fabrication using the same

An inspection system, comprising:

• a stage that that is configured to load a semiconductor substrate;
• an inspection apparatus that is configured to inspect a plurality of patterns formed on the semiconductor substrate;
• and
• a computer connected to the inspection apparatus,
• wherein the computer is configured to perform operations comprising:
• providing a pattern layout that corresponds to the patterns;
• generating a first measurement map including a plurality of first measurement regions that overlap a plurality of measurement points on the pattern layout in a two-dimensional plan view;
• providing a plurality of preliminary measurement regions on corresponding measurement points;
• producing a polygon by grouping ones of the preliminary measurement regions, wherein the ones of the preliminary measurement regions overlap each other in the two-dimensional plan view;
• providing a second measurement region on a center of the polygon;
• selecting the second measurement region when all of the measurement points in the polygon overlap the second measurement region in the two-dimensional plan view;
• generating a second measurement map that includes the selected second measurement region;
• and
• generating a third measurement map by using the first measurement map and the second measurement map, and
• wherein the inspection apparatus is configured to use the third measurement map to inspect the patterns on the semiconductor substrate.

A semiconductor fabrication method, comprising:

• forming a plurality of patterns on a semiconductor substrate;
• loading the semiconductor substrate on a stage of an inspection system, the semiconductor substrate having the patterns formed thereon;
• and
• inspecting the patterns by using an inspection apparatus of the inspection system,
• wherein a computer connected to the inspection apparatus is configured to perform operations comprising:
• providing a pattern layout that corresponds to the patterns;
• generating a first measurement map including a plurality of first measurement regions that overlap a plurality of measurement points of the pattern layout in a two-dimensional plan view;
• providing a plurality of preliminary measurement regions on corresponding measurement points;
• producing a polygon by grouping ones of the preliminary measurement regions, wherein the ones of the preliminary measurement regions overlap each other in the two-dimensional plan view;
• providing a second measurement region on a center of the polygon;
• selecting the second measurement region when all of the measurement points in the polygon overlap the second measurement region in the two-dimensional plan view;
• generating a second measurement map that includes the selected second measurement region;
• and
• generating a third measurement map by using the first measurement map and the second measurement map, and
• wherein the inspection apparatus is configured to inspect the patterns by using the third measurement map generated by the computer.