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US 12,055,498 B2Granted
Data processing method and system for detection of deterioration of semiconductor process kits
AssigneeTop Technology Platform Co., Ltd.
InventorsChyuan-Ruey Lin, Feng-Min Shen, Hung-Chia Su
Life of this patent
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Abstract
A data processing method for detection of deterioration of semiconductor process kits includes the following steps: acquiring a plurality of Raman spectra data of a semiconductor process kit and performing a plurality calculating processes on the Raman spectra data to obtain a first deterioration state determining parameter indicating the aging degree of the entire semiconductor process kit and a second deterioration state determining parameter indicating the degree of variation of the internal molecular structure of the semiconductor process kit.
Claims7
A data processing method for detection of deterioration of semiconductor process kits to predict lifetime of the semiconductor process kits, comprising:
- receiving Raman spectra data detected on a semiconductor process kit under detection by a deterioration detecting system having at least a Raman spectrometer, an optical detecting unit adapted to the Raman spectrometer, a controlling-computing unit adapted to the Raman spectrometer, and a Raman spectra database unit adapted to the controlling-computing unit, and stored in the Raman spectra database unit, with a data processing system having a microprocessor and connecting to the deterioration detecting system;
- performing at least two-dimensional alignment calculation with the microprocessor on the received Raman spectra data to eliminate inconsistency of the deterioration detection of the semiconductor process kit under detection within different deterioration detecting systems of the semiconductor process kits;
- performing derivative calculation with the microprocessor on the Raman spectra data resulted from the alignment calculation to perform ratio calculation with respect to different dimensions on gaps between any two of all spectral peaks of each of the Raman spectra data to obtain a first parameter representing changes of strength of all the spectral peaks of each of the Raman spectra data as the Raman spectra shift changes;
- performing scaling and normalization with the microprocessor on the first parameter to adjust scale of the first parameter in every dimension and eliminate duplicate and abnormal parts of the first parameter to obtain a second parameter;
- performing dimension reduction calculation with the microprocessor on the second parameter to reduce complexity of the second parameter and simplify the subsequent calculation to obtain a third parameter;
- and
- performing standard deviation calculation with the microprocessor on the third parameter to obtain a first deterioration state determining parameter and a second deterioration state determining parameter, wherein the first deterioration state determining parameter relates to an average value resulted from the standard deviation calculation and is used to indicate aging degree of the semiconductor process kit, while the second deterioration state determining parameter relates to a discrete value resulted from the standard deviation calculation and is used to indicate degree of variation of internal molecular structure of the semiconductor process kit;
- wherein the first deterioration state determining parameter and the second deterioration state determining parameter are used to predict lifetime of the semiconductor process kit.
5 more elements
A data processing system for detection of deterioration of semiconductor process kits to predict lifetime of the semiconductor process kits, comprising:
- an alignment calculation unit to receive a plurality of Raman spectra data of a semiconductor process kit under detection and perform error unification calculation on the Raman spectra data with respect to all dimensions to eliminate inconsistency of the detection results of the semiconductor process kit under detection within different deterioration detecting systems of the semiconductor process kits, wherein the Raman spectra data of the semiconductor process kit is stored in multiple Raman spectra database units each included in a deterioration detecting system having a Raman spectrometer;
- a derivative calculation unit being electrically connected with the alignment calculation unit to receive the Raman spectra data resulted from the alignment calculation unit and to perform ratio calculation with respect to different dimensions on the gaps between any two of all the spectral peaks of each of the resulted Raman spectra data to obtain a first parameter representing changes of the strength of all the spectral peaks of each of the Raman spectra data as the Raman spectra shift changes;
- a scale normalization unit being electrically connected with the derivative calculation unit to receive the first parameter and to perform scaling and normalization on the first parameter to adjust scale of the first parameter in every dimension and eliminate duplicate and abnormal parts of the first parameter to obtain a second parameter;
- a dimension reduction calculation unit being electrically connected with the scale normalization unit to receive the second parameter and to perform dimension reduction calculation on the second parameter to reduce complexity of the second parameter and simplify the subsequent calculation to obtain a third parameter;
- a standard deviation calculation unit being electrically connected with the dimension reduction calculation unit to receive the third parameter and to perform standard deviation calculation on the third parameter to obtain a first deterioration state determining parameter relating to an average value resulted from the standard deviation calculation and a second deterioration state determining parameter relating to a discrete value resulted from the standard deviation calculation;
- and
- a microprocessor being electrically connected with the alignment calculation unit, the derivative calculation unit, the scale normalization unit, the dimension reduction calculation unit, and the standard deviation calculation unit to execute all the calculations;
- wherein the first deterioration state determining parameter is used to indicate aging degree of the semiconductor process kit while the second deterioration state determining parameter is used to indicate degree of variation of internal molecular structure of the semiconductor process kit, and lifetime of the semiconductor process kit is predicted by the first deterioration state determining parameter and the second deterioration state determining parameter.
5 more elements
Dependencies are inferred from the claim text.