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US 12,053,934 B2Granted
Conductive film adhesive
AssigneeOrmet Circuits, Inc.
InventorsCatherine A. Shearer, Peter A. Matturri, Michael C. Matthews
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Abstract
An inventive composition and process for formation of a conductive bonding film are disclosed. The invention combines adhesive bonding sheet technologies (e.g. die attach films, or DAFs) with the electrical and thermal conductivity performance of transient liquid phase sintered paste compositions. The invention films are characterized by high bulk thermal and electrical conductivity within the film as well as low and stable thermal and electrical resistance at the interfaces between the inventive film and metallized adherends.
Claims18
A method for attaching a first adherend to a second adherend comprising the steps of:
- providing a conductive film adhesive deposited on a carrier material, wherein the conductive film adhesive comprises two or more layers of conductive film adhesive laminated together to form a single film, wherein a first surface of the conductive film adhesive is exposed and wherein the conductive film adhesive comprises:
- i) a polymer selected from the group consisting of phenoxies and polyamides, wherein the polymer has a weight-average molecular weight of 10,000-75,000,
- ii) a flux, and
- iii) a filler comprising a mixture of metallic particles wherein the mixture of particles comprises at least one reactive metallic element R1 and at least one reactive metallic element R2;
- contacting the first surface of the conductive film adhesive to a surface of the first adherend;
- removing the carrier material from the conductive film adhesive to expose a second surface of the conductive film adhesive;
- contacting the second surface of the conductive film adhesive to a surface of the second adherend to form an assembly;
- and
- thermally processing the assembly at a temperature T1 wherein R1 and R2 form a network comprising at least one intermetallic species disposed between the first and second adherends, wherein the first and second adherends are substantially permanently bonded together.
6 more elements
A method for attaching a first adherend to a second adherend comprising the steps of:
- providing a conductive film adhesive deposited on a carrier material, wherein the conductive film adhesive comprises two or more layers of conductive film adhesive laminated together to form a single film, wherein a first surface of the conductive film adhesive is exposed and wherein the conductive film adhesive comprises:
- i) a polymer selected from the group consisting of phenoxies and polyamides, wherein the polymer has a weight-average molecular weight of 10,000-75,000,
- ii) a flux, and
- iii) a filler comprising a mixture of metallic particles wherein the mixture of particles comprises at least one reactive metallic element R1 and at least one reactive metallic element R2;
- contacting the first surface of the conductive film adhesive to a surface of the first adherend;
- removing the carrier material from the conductive film adhesive to expose a second surface of the conductive film adhesive;
- contacting the second surface of the conductive film adhesive to a surface of the second adherend to form an assembly;
- and
- thermally processing the assembly at a temperature T1 wherein R1 and R2 form a network comprising at least one intermetallic species disposed between the first and second adherends, wherein the first and second adherends are substantially permanently bonded together;
- wherein the said flux comprises at least one amino acid or at least one carboxylic acid having a molecular weight less than 300 Da, and wherein said at least one amino acid comprises at least one tertiary amine.
7 more elements
A method for attaching a first adherend to a second adherend comprising the steps of:
- providing a conductive film adhesive deposited on a carrier material, wherein the conductive film adhesive is provided on the carrier material as a monolayer, wherein a first surface of the conductive film adhesive is exposed and wherein the conductive film adhesive comprises:
- i) a polymer selected from the group consisting of phenoxies and polyamides, wherein the polymer has a weight-average molecular weight of 10,000-75,000,
- ii) a flux, and
- iii) a filler comprising a mixture of metallic particles wherein the mixture of particles comprises at least one reactive metallic element R1 and at least one reactive metallic element R2;
- removing the carrier material from the conductive film adhesive to expose a second surface of the conductive film adhesive;
- contacting the first surface of the conductive film adhesive to a surface of the first adherend;
- contacting the second surface of the conductive film adhesive to a surface of the second adherend to form an assembly;
- and
- thermally processing the assembly at a temperature T1 wherein R1 and R2 form a network comprising at least one intermetallic species disposed between the first and second adherends, wherein the first and second adherends are substantially permanently bonded together.
6 more elements
Dependencies are inferred from the claim text.